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Monitoring device and method for wire web monitoring and wire saw

A measuring device and wire mesh technology, which is applied in the field of sensors for monitoring wire mesh conditions, wire saws for cutting workpieces, and wire mesh condition monitoring in wire saws), can solve problems such as difficult wire meshes to generate accurate images, expensive systems, etc., and achieve The effect of enlarging the effective resolution

Inactive Publication Date: 2015-11-11
MEYER BURGER AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Typically have 1000s of segments in the wire mesh of the cut workpiece, which results in a very expensive system
[0014] Clearly, such camera-based systems struggle to produce accurate images of wire webs covered with slurry or cutting fluid

Method used

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  • Monitoring device and method for wire web monitoring and wire saw
  • Monitoring device and method for wire web monitoring and wire saw
  • Monitoring device and method for wire web monitoring and wire saw

Examples

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Embodiment Construction

[0078] The present invention will be described with reference to exemplary embodiments and is not limited to a particular wire saw, method or sensor except as defined in the appended claims. Embodiments of the invention can be used in various method and system forms. It will be apparent to those skilled in the art that the present invention can be implemented in various ways within the scope of the claims. All features shown in relation to the figures apply in principle to the invention as described in the claims.

[0079] As used herein, the indefinite article ("a", "an") means that there is at least one of the referenced term and the term "plurality" means that there is more than one.

[0080] The present invention relates to systems, methods and production equipment, and more particularly to wire saws, and in particular to multi-wire saws for cutting hard, brittle materials such as silicon, sapphire and quartz, methods for operating such multi-wire saws and their Ingenuit...

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PUM

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Abstract

An improved and simplified system and method for monitoring the wire web of a wire saw is described. The system contains a sensor that is moved over the wire web and thus determines the deflection of individual wires of the wire web or of wire groups thereof.

Description

technical field [0001] The present invention relates to wire saws, in particular multi-wire saws, and to wire saws for monitoring wire saws used for cutting hard, brittle materials such as polycrystalline and monocrystalline silicon, such as are used in the semiconductor and optoelectronic industries. methods for network conditions, and sensors for monitoring network conditions. More particularly, the present invention relates to a wire saw for cutting a workpiece, the wire saw comprising: (at least two) wire guide rollers for forming a wire web comprising at least one cutting wire for cutting a workpiece Adjacent segments of the wire; a feed table for mounting the workpiece and moving the workpiece toward the wire web; a controller for controlling the movement of the wire guide rollers and the feed table; and a wire web monitoring system for monitoring the wire segment of the wire web, The wire web monitoring system comprises a deviation measuring device with one or more sen...

Claims

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Application Information

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IPC IPC(8): B23D59/00B28D5/00B28D5/04
CPCB23D59/002B28D5/0064B28D5/045
Inventor 丹尼尔·兹恩
Owner MEYER BURGER AG
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