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Flexible organosilicone sealant for LED package and preparation method thereof

A LED packaging and flexibility technology, applied in adhesives, adhesive additives, electrical components, etc., can solve the problems of poor flexibility of silicone potting adhesives, and achieve reduced cross-linking density, low modulus, and high elongation Effect

Active Publication Date: 2015-11-25
CHINA BLUESTAR CHENGRAND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention aims to solve the problem of poor flexibility of silicone potting glue in the prior art, and provides a flexible silicone sealant for LED packaging, which has better flexibility

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A flexible silicone sealant for LED packaging, comprising the following raw materials in parts by weight:

[0032] Medium viscosity dihydroxy polydimethylsiloxane 50 parts

[0033] High viscosity dihydroxy polydimethylsiloxane 50 parts

[0034] 10 parts of dimethyl dibutyl ketoximosilane

[0035] 10 parts of methyl tributylketoxime silane

[0036] TiO 2 20 copies

[0037] 30 parts mica

[0038] 0.5 parts of dibutyltin dilaurate

[0039] 0.5 parts of stannous octoate

[0040] 10 parts of chain extender.

Embodiment 2

[0042] A flexible silicone sealant for LED packaging, comprising the following raw materials in parts by weight:

[0043] Medium viscosity dihydroxy polydimethylsiloxane 55 parts

[0044] High viscosity dihydroxy polydimethylsiloxane 60 parts

[0045] 16 parts of dimethyl dibutylketoxime silane

[0046] 16 parts of methyl tributyl ketoxime silane

[0047] TiO 2 23 copies

[0048] Mica 36 parts

[0049] 2.5 parts of dibutyltin dilaurate

[0050] 0.9 parts of stannous octoate

[0051] 18 parts of chain extender.

Embodiment 3

[0053] A flexible silicone sealant for LED packaging, comprising the following raw materials in parts by weight:

[0054] Medium viscosity dihydroxy polydimethylsiloxane 52.5 parts

[0055] High viscosity dihydroxy polydimethylsiloxane 55 parts

[0056] 13 parts of dimethyl dibutylketoxime silane

[0057] 13 parts of methyl tributylketoxime silane

[0058] TiO 2 21.5 servings

[0059] 33 parts mica

[0060] 1.5 parts of dibutyltin dilaurate

[0061] 0.7 parts of stannous octoate

[0062] 14 parts of chain extender.

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Abstract

The present invention relates to a flexible organosilicone sealant for LED package and a preparation method thereof, and belongs to the technical field of silicone sealant. The silicone sealant includes 50-55 parts of medium-viscosity dihydroxy polydimethylsiloxane, 50-60 parts of high-viscosity dihydroxy polydimethylsiloxane, 10-16 parts of dimethyl dibutanoneoximido silane, 10-16 parts of methyltris(methylethylketoximino)silane, 20-23 parts of TiO2, 30-36 parts of mica, 0.5-2.5 parts of dibutyltin dilaurate, 0.5-0.9 part of stannous octoate and 10-18 parts of a chain extender. The present invention uses a chain extender, so that the organosilicone sealant while cross-linking increases the chain length of polymer crosslinking point molecules, and reduces the crosslinking density in network structure. The prepared sealant has low modulus and high elongation properties, and meets the requirements for such materials in LED package.

Description

technical field [0001] The invention relates to a silicone sealant and a preparation method thereof. More specifically, the invention relates to a flexible silicone sealant for LED packaging and a preparation method thereof, belonging to the technical field of silicone sealants. Background technique [0002] In the packaging of LEDs, silicone sealing materials are often required to have excellent flexibility to meet the normal use of such electronic products under some special environmental conditions. This requires the sealing material to have mechanical properties of low modulus and high elongation after curing. Therefore, this new type of silicone sealing material has become a research hotspot. [0003] The State Intellectual Property Office published an opinion publication number of CN104371637A on 2015.2.25, named "one-component dealcoholized silicone potting compound and its preparation method", the invention consists of the following raw materials in proportion by we...

Claims

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Application Information

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IPC IPC(8): C09J183/06C09J11/06C09J11/04H01L33/56
Inventor 毛云忠曹先军王凤德赵奕崔晓静高川刘咏梅
Owner CHINA BLUESTAR CHENGRAND CO LTD
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