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Packaging structure and packaging method of intelligent card chip

A technology of smart card chip and packaging structure, applied in the field of smart cards, can solve problems such as high cost and excessive chip area, and achieve the effects of improving utilization rate, reducing chip area and improving product performance

Active Publication Date: 2015-11-25
上海伊诺尔信息电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its disadvantage is that the chip area is too large and the cost is too high

Method used

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  • Packaging structure and packaging method of intelligent card chip
  • Packaging structure and packaging method of intelligent card chip
  • Packaging structure and packaging method of intelligent card chip

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0026] The specific implementation of the smart card chip packaging structure and packaging method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0027] see Figure 4 and Figure 5 , The first embodiment of a smart card chip packaging structure of the present invention includes a substrate 40 and a flip chip 41 flip-chip soldered to the substrate 40 .

[0028] Some pins of the flip chip 41 are flip-chip soldered to the substrate 40 . In this specific embodiment, a part of the pins of the flip chip 41 is implanted with solder balls 42, and the flip chip 41 is turned over so that the solder balls 42 are in contact with the substrate 40, and the solder balls 42 are melted. Some pins of the flip chip 41 are fixed and electrically connected to the substrate 40 through solder balls 42 .

[0029] At least one welding pad 43 is provided on the substrate 40, and the welding pad 43 is exposed outside the flip chip ...

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PUM

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Abstract

The invention provides a packaging structure and a packaging method of an intelligent card chip. The packaging structure comprises a substrate and a flip chip, wherein the flip chip and the substrate are in flip-chip bonding; one part of pins of the flip chip is connected to the substrate in a flip-chip bonding manner; at least one welding pad is arranged on the substrate, and is exposed outside the flip chip; and on one surface, departing from the substrate, of the flip chip, the other part of pins of the flip chip is electrically connected with the welding pad through metal leads. The packaging structure has the advantages that two packaging modes of flip-chip bonding and routing packaging are simultaneously adopted; compared with flip-chip bonding, the chip area is reduced; reduction of the cost is facilitated; and compared with routing packaging, the utilization rate of the chip is improved.

Description

technical field [0001] The invention relates to the field of smart cards, in particular to a smart card chip packaging structure and packaging method. Background technique [0002] At present, the packaging of smart card chips mainly has the following two methods. [0003] see figure 1 One way is wire bonding, which is a kind of use of thin metal wires 10, using heat, pressure, and ultrasonic energy to make the metal wires 10 and the pads 11 of the substrate 13 tightly welded, so as to realize the bonding between the chip 12 and the substrate 13. Electrical interconnection and information exchange between chips. Under ideal control conditions in this packaging method, electron sharing or mutual diffusion of atoms will occur between the lead and the substrate, so that the bonding between the two metals can be achieved at the atomic level. However, its disadvantage is that the chip area is limited and it is difficult to meet complex functions. [0004] see figure 2 and ...

Claims

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Application Information

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IPC IPC(8): H01L23/488H01L23/49H01L21/60
CPCH01L2224/16245H01L2224/48091H01L2224/49171H01L2224/73257H01L2924/00014
Inventor 高洪涛陆美华刘玉宝沈爱明张立
Owner 上海伊诺尔信息电子有限公司