Processing method for circuit board
A processing method and circuit board technology, applied in the direction of electrical connection formation of printed components, etc., can solve the problems of over-corrosion, under-corrosion and damage of circuit patterns, reduce over-corrosion or under-corrosion, improve the uniformity of copper thickness, and reduce the number of times. Effect
Active Publication Date: 2015-11-25
SHENNAN CIRCUITS
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Problems solved by technology
[0005] The above-mentioned process solves the problem that the opening of the power amplifier slot is easily damaged by mechanical shoveling. However, in the above-mentioned process, the via hole and the power amplifier slot need to be made twice, and the copper plating process needs to be performed twice, which has the defect of complex process flow; In addition, two times of copper plating will lead to serious uneven copper thickness on the surface of the circuit board, which will easily cause defects such as over-corrosion or under-corrosion when etching circuit patterns, resulting in the inability to produce finer circuit patterns
Method used
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Embodiment 1
[0027] Please refer to figure 1 , an embodiment of the present invention provides a method for processing a circuit board, which may include:
[0028] 110. Processing through holes and power amplifier slots on the multi-layer board.
[0029] In the embodiment of the present invention, the circuit board may be a multi-layer board formed by laminating double-sided copper-clad laminates. Such as Figure 2a As shown, it is a schematic diagram of a circuit board 200 in this embodiment, and the circuit board 200 may include two outer metal layers, at least one inner circuit layer, and multiple insulating dielectric layers. Optionally, the metal base 201 may be embedded on the circuit board, and it is assumed that the side of the multilayer board embedded with the metal base 201 is the first side.
[0030] Such as Figure 2b As shown, in this embodiment, the mechanical drilling process can be used to form the through hole 202 on the circuit board 200 , and the controlled depth mi...
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The invention discloses a processing method for a circuit board. An opening of a power amplification groove is prevented from damage during leveling of a resin plug pole. In addition, the manufacturing technology is simplified, the cooper precipitation electroplating frequency is lowered and the copper thickness uniformity of a surface of a circuit board is raised, which facilitates to manufacture a fine circuit. The method comprises steps: through holes and power amplification grooves are processed in a multilayer board; metallization of the through holes and the power amplification grooves are carried out; resins are loaded in the through holes; water is injected into the power amplification grooves and frozen into ice; superfluous resins around the openings of the through holes are removed.
Description
technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board processing method. Background technique [0002] In a circuit board with an embedded metal base, a power amplifier slot is generally opened above the metal base, and the power amplifier slot can be used to accommodate chips or other types of electronic components. [0003] During the production process of the above-mentioned circuit board, resin plugging is often required for the through-holes on the circuit board, and after the resin plugs the holes, there will generally be excess resin remaining at the opening of the through-hole, for example, the resin will protrude at the opening, etc. . At this time, it is necessary to use a mechanical shoveling process to shovel the excess resin. Since the opening of the power amplifier slot is much larger than the opening of the through hole, the metal layer at the opening of the power amplifier slot is e...
Claims
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Inventor 缪桦李传智周艳红黄潮坤黄友华
Owner SHENNAN CIRCUITS