A heating simulation device and a heat dissipation performance detection device of a heat pipe

Abstract

The invention provides a heating simulation device and a heat pipe heat dispersion detection device. The heating simulation device comprises a central processing unit (CPU), a linear power supply, a heating element, a first temperature collector and a second temperature collector. The CPU is used for controlling the working voltage of the linear power supply and controlling the working voltage of the linear power supply to be adjusted according to the temperature values collected by the first temperature collector and the second temperature collector. The linear power supply is used for adjusting the working voltage according to working voltage control parameters sent by the CPU and supplying power to the heating element. The heating element is used for giving out heat according to the working voltage of the linear power supply. The first temperature collector is used for collecting the environment temperature and sending the environment temperature to the CPU. The second temperature collector is used for collecting the surface temperature of the heating element and sending the surface temperature of the heating element to the CPU. By means of the heating simulation device and the heat pipe heat dispersion detection device, heating of IC chips can be well simulated, heat dispersion numerical quantization of a heat pipe is achieved by simulation heating, and thus the heat pipe can be detected more quickly and efficiently.

Description

technical field [0001] The invention relates to the technical field of communication equipment testing, in particular to a heat generation simulation device and a heat pipe heat dissipation performance detection device. Background technique [0002] With the intensive and complex development of integrated circuits, the heat generated by its electronic components during operation also increases sharply, which increases the temperature of components and affects the normal operation of components. Therefore, a cooling device must be installed to ensure that the heating components such as the central processing unit or other high-temperature chips work normally at an appropriate temperature. However, how to ensure that the installed heat dissipation device can meet the heat dissipation requirements of components or chips needs to be realized through multiple tests. At present, most of the heat generation and heat dissipation tests of IC chips with large heat generation such as ...

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Problems solved by technology

However, the collision of heat pipes in the process of manufacturing and transportation will easily produce cracks that are invisible to the naked eye, resulting in a decrease in the vacuum in the cavity and greatly reducing its thermal conductivity. These cracks are difficult to detect by visual inspection, so they can only be checked one by one. The heat dissipation performance of the heat pipe is tested to determine whether it is qualified

The general test method for heat pipe thermal conductivity is to hold one end of the heat pipe and immerse the other end in hot water. After a period of time, the temperature feeling of the hand-held end of the heat pipe can be used to judge whether the heat conduction performance of the heat pipe can meet the requirements. The efficiency of this test method is low. In addition, it mainly relies on people's subjective feelings to make judgments. There are no quantitative indicators, and the test results are very inaccurate.

[0004] Most of the test methods for FPGA heat dissipation in the prior art are realized by computer simulation, but the actual heat dissipation of FPGA work is also related to actual factors such as the indoor temperature and the smoothness of the contact surface with the heat pipe, so the method of computer simulation and simulation of FPGA work and heat dissipation It is difficult to truly reflect the actual working conditions of the heat pipe cooling device in the RRU

Moreover, there are many ways to adjust the constant power and constant temperature of the heat source in the industry, such as using a temperature controller, but the test efficiency is too low and not suitable for mass production

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