A Wear Leveling Method for Variable Resistive Memory Based on Software Compilation Layer

A technology of resistive memory and wear leveling, which is applied in the direction of memory address/allocation/relocation, input/output to record carrier, etc., can solve the problems of limiting the practical application of variable resistive memory, not small overhead, etc., and achieve fine detail Granularity, improved service life, and low storage overhead

Active Publication Date: 2018-02-02
CHONGQING UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Prior art one has following shortcoming: need the support on hardware
Disadvantages of prior art 2: monitoring memory page faults to calculate the corresponding benefit function value is unavoidable and will cause a lot of overhead; only based on memory page faults to regulate the conversion of MLC and SLC
These existing technologies have huge writing overhead and running overhead, and most of them require the support of hardware and operating system, thus limiting the practical application of variable resistance memory in embedded systems

Method used

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  • A Wear Leveling Method for Variable Resistive Memory Based on Software Compilation Layer
  • A Wear Leveling Method for Variable Resistive Memory Based on Software Compilation Layer
  • A Wear Leveling Method for Variable Resistive Memory Based on Software Compilation Layer

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Embodiment Construction

[0018] Below in conjunction with accompanying drawing and embodiment the present invention will be further described:

[0019] The present invention comprises the following steps:

[0020] Step 1. According to the characteristics of the program, the program is divided into multiple program areas, and the number of write operations and the size of each variable are counted;

[0021] Step 2, according to the size of the unoccupied space of the memory, dynamically configure the size of the single-layer unit and the multi-layer unit of the variable resistance memory;

[0022] Step 3. Allocate appropriate addresses for each variable, allocate high-performance and long-life SLC for frequently written variables, and allocate large-capacity MLC for infrequently written variables, thereby reducing the access delay of variable programs and improving variable Resistive memory lifetime;

[0023] Step 4. Execute the compiled program on the embedded system to obtain wear leveling on the v...

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Abstract

The invention discloses a wear leveling method for a variable resistance memory based on a software compilation layer, which includes the following steps: 1. According to the characteristics of the program, the program is divided into multiple program areas, and the number of write operations of each variable is counted and variable size; 2. According to the size of the unoccupied memory space, dynamically configure the size of the variable resistance memory SLC and MLC; 3. Allocate appropriate addresses for each variable, and allocate high performance and lifespan for frequently written variables Long single-layer units, allocate multi-layer units with large capacity for infrequently written variables, 4. Execute the compiled program on the embedded system to obtain wear leveling on the variable resistance memory. The invention has the following technical effects: better wear balance, further improving the service life of the variable resistance memory; only requiring very low execution time and storage overhead, and no hardware overhead.

Description

technical field [0001] The invention belongs to the technical field of computer storage, and in particular relates to a wear leveling method of a variable resistance memory. Background technique [0002] General-purpose DRAM memory is limited by problems such as high energy consumption and difficult expansion of capacity. A new type of low energy consumption, large capacity, non-volatile memory is expected to replace traditional DRAM memory, such as memory bank memory and variable resistance memory (PCM). In particular, the variable resistance memory PCM can implement a multi-level cell (Multi-Level Cell, MLC), that is, one cell can store two or more bits. Compared with single-level cell (Single-Level Cell, SLC), MLC can obtain higher density and larger capacity. However, this advantage also comes at a corresponding cost, due to the need for more precise sensing and control of the resistance of the PCM cells, increased corresponding access delays and reduced lifetime. [...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/06G06F12/06
Inventor 刘铎朱萧龙林波梁靓沙行勉
Owner CHONGQING UNIV
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