Directly-inserted power semiconductor module test clamp

A technology for power semiconductor and module testing, which is used in single semiconductor device testing, semiconductor/solid-state device testing/measurement, semiconductor/solid-state device manufacturing, etc. The effect of expanding the scope of application

Active Publication Date: 2015-12-02
西安派瑞功率半导体变流技术股份有限公司
View PDF7 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, the module test fixture was mainly aimed at the modules whose conductive strips were parallel to the bottom plate, and used test probes or test conductive columns for voltage and current testing; while the modules whose conductive strips were perpendicular to the bottom plate usually used inserts and screws in actual use. Or welding to connect wires, but it is not allowed to damage the electrode surface of the module during the factory t

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Directly-inserted power semiconductor module test clamp
  • Directly-inserted power semiconductor module test clamp
  • Directly-inserted power semiconductor module test clamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] 1. Design points of the present invention

[0015] 1) Overall structure design

[0016] The basic overall structure of this fixture is a door-type box structure, and the main part is: upper fixed plate 1, support rod 2, bottom plate 6 and three-axis cylinder 7; two support rods 2 are fixed on the bottom plate 6, and the upper fixed plate 1 passes through The nuts are fixed on the two support rods 2 to form a portal frame structure; the three-axis cylinder 7 is installed on the bottom plate 6, and the module lifting table 5 is fixed on the three-axis cylinder 7, which is used to lift the measured module 3 to move up and down; A positioning plate 4 is installed on the module lifting platform 5, and the positioning plate 4 can be replaced according to the shape of the measured module 3 to ensure that the electrode position of the module is accurate; the entire electrode clamping and signal sampling mechanism assembly is located on the upper fixing plate 1.

[0017] 2) Des...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a directly-inserted power semiconductor module test clamp composed of a basic door-style frame structure formed by an upper fixing plate, a supporting rod, and a base plate, a triaxial cylinder disposed on the base plate, a module elevating table fixed to the triaxial cylinder, a positioning plate disposed on the module elevating table, a tested module disposed on the module elevating table and supported by the module elevating table to move up and down, and an electrode clamping and signal sampling mechanism assembly. In view of a characteristic that a directly-inserted module conductive sheet is arranged vertical to the base plate, elastic contact electrodes on the test clamp clamp the electrodes of the module by means of the motion of the test clamp so as to achieve reliable contact and perform testing. Therefore, the directly-inserted power semiconductor module test clamp may prevent the electrodes of the module from damaging and has voltage drop testing and high-voltage testing functions of the tested module with heavy current.

Description

technical field [0001] The invention relates to a test fixture for factory inspection of conventional electrical parameters of an in-line power semiconductor module. Aiming at the characteristic that the conductive sheets of the in-line module are arranged perpendicular to the bottom plate, the elastic contact electrodes on the fixture can move the module through the movement of the fixture. Each electrode is clamped to achieve reliable contact and tested. The jig can also conduct intermediate tests in the production process of modules whose conductive sheets are parallel to the bottom plate before the electrodes are bent, that is, semi-finished products, so as to improve the detection rate of unqualified products. Background technique [0002] At present, in the field of power semiconductor applications, the application range of modules is more and more extensive, and the shapes of modules are various. There are mainly two types of modules with conductive sheets parallel to...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/60G01R1/04G01R31/26
CPCH01L22/30G01R1/0425G01R31/26
Inventor 李更生肖秦粱房齐
Owner 西安派瑞功率半导体变流技术股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products