Directly-inserted power semiconductor module test clamp

Abstract

The invention relates to a directly-inserted power semiconductor module test clamp composed of a basic door-style frame structure formed by an upper fixing plate, a supporting rod, and a base plate, a triaxial cylinder disposed on the base plate, a module elevating table fixed to the triaxial cylinder, a positioning plate disposed on the module elevating table, a tested module disposed on the module elevating table and supported by the module elevating table to move up and down, and an electrode clamping and signal sampling mechanism assembly. In view of a characteristic that a directly-inserted module conductive sheet is arranged vertical to the base plate, elastic contact electrodes on the test clamp clamp the electrodes of the module by means of the motion of the test clamp so as to achieve reliable contact and perform testing. Therefore, the directly-inserted power semiconductor module test clamp may prevent the electrodes of the module from damaging and has voltage drop testing and high-voltage testing functions of the tested module with heavy current.

Description

technical field [0001] The invention relates to a test fixture for factory inspection of conventional electrical parameters of an in-line power semiconductor module. Aiming at the characteristic that the conductive sheets of the in-line module are arranged perpendicular to the bottom plate, the elastic contact electrodes on the fixture can move the module through the movement of the fixture. Each electrode is clamped to achieve reliable contact and tested. The jig can also conduct intermediate tests in the production process of modules whose conductive sheets are parallel to the bottom plate before the electrodes are bent, that is, semi-finished products, so as to improve the detection rate of unqualified products. Background technique [0002] At present, in the field of power semiconductor applications, the application range of modules is more and more extensive, and the shapes of modules are various. There are mainly two types of modules with conductive sheets parallel to...

AI Technical Summary

Problems solved by technology

In the past, the module test fixture was mainly aimed at the modules whose conductive strips were parallel to the bottom plate, and used test probes or test conductive columns for voltage and current testing; while the modules whose conductive strips were perpendicular to the bottom plate usually used inserts and screws in actual use. Or welding to connect wires, but it is not allowed to damage the electrode surface of the module during the factory test of the module, and high current and high withstand voltage are often required to be tested. For modules with small currents, test probes are usually used to contact the module in the past. The top end surface of the electrode is tested, but the thickness of the top end surface of the electrode is usually only about 1mm, so it is only suitable for small current testing. When the current is large, sparking will occur due to the small conductive area

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