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Intelligent card tin dipping equipment with soldering tin protection function

A protection function, smart card technology, applied in welding equipment, metal processing equipment, tin feeding device, etc., can solve the problems of high cost, affecting welding quality, falling on the card 1 or chip, etc., to achieve low cost and improve welding Quality, the effect of improving quality

Inactive Publication Date: 2015-12-09
GUANGZHOU MINGSEN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the above-mentioned production process, the tin pot 3 used is in an open state, and the molten solder 4 is oxidized due to direct contact with the air, forming an oxide layer on the surface of the molten solder 4; when the antenna 1-1 is immersed in the solder, it will be combined with the The oxides stick together, and these oxides form tin slag on the antenna 1-1, and fall onto the card 1 or chip when the antenna 1-1 is soldered to the chip, which affects the welding quality; the solder needs to be replaced frequently, and the cost is high

Method used

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  • Intelligent card tin dipping equipment with soldering tin protection function
  • Intelligent card tin dipping equipment with soldering tin protection function
  • Intelligent card tin dipping equipment with soldering tin protection function

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Embodiment Construction

[0029] Hereinafter, the present invention will be further described in detail with reference to the examples and drawings, but the implementation of the present invention is not limited thereto.

[0030] See figure 2 The smart card soldering equipment with solder protection function of the present invention includes a soldering device, a card conveying mechanism and a sealing cover 5. The soldering device is arranged in the sealing cover 5, and the card conveying mechanism is removed from the sealing cover 5. Through; The sealing cover 5 is filled with inert gas.

[0031] See figure 2 with image 3 An inert gas supplement device is connected to the sealing cover 5, which includes an inert gas storage tank, a gas pipe connecting the inert gas storage tank and the sealing cover 5, a gas pump connected to the gas pipe, and a solenoid valve. The purpose of the above-mentioned inert gas replenishing device is to replenish the inert gas in the sealing cover 5 in time. Since the card co...

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PUM

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Abstract

The invention discloses intelligent card tin dipping equipment with a soldering tin protection function. The intelligent card tin dipping equipment comprises a tin dipping device and a card conveying mechanism, and further comprises a sealing cover, wherein the tin dipping device is arranged in the sealing cover; the card conveying mechanism penetrates through the sealing cover; and the sealing cover is filled with inert gas. The intelligent card tin dipping equipment can ensure that melted soldering tin is not oxidized in a production process; and the chip welding quality of an intelligent card is improved and the production cost is saved.

Description

Technical field [0001] The invention relates to a production equipment of a smart card, in particular to a smart card tinning equipment with a solder protection function. Background technique [0002] In the production process of smart cards, a chip needs to be set in the card. See figure 1 In the prior art, the basic process of setting the chip is: first mill the chip slot 1-2 on the card 1, so that the two ends of the antenna 1-1 arranged in the card 1 are exposed; Both ends are lifted up to be vertical; then the card 1 is moved to the tin pot 1 with molten solder 4, and both ends of the antenna 1-1 on the card 1 are immersed in the molten solder 4 to remove the antenna 1- 1 The insulating layer made of enameled wire on the surface is covered with solder; finally, the chip is soldered to the end of the antenna 1-1, and the chip is packaged in the chip slot 1-2. [0003] In the above production process, the tin pot 3 used is in an open state, and the molten solder 4 is oxidized ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/06
CPCB23K3/0669B23K3/0676
Inventor 王开来吴伟文陈胜华房训军黄文豪魏广来何辉郑鸿飞岳亚涛
Owner GUANGZHOU MINGSEN TECH CO LTD
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