Elasticity testing socket for low-temperature application

Abstract

Provided is an elasticity testing socket for low-temperature application. The elasticity testing socket includes a heat conduction pedestal, a PCB circuit board, an elasticity thrusting needle, an elasticity needle guide plate and an assembly needle guide plate, and other parts. The elasticity needle guide plate and the assembly needle guide plate achieve precise alignment via a positioning pin. A pin of a focal plane assembly inserts the assembly needle guide plate and subsequently is in contact with the elasticity thrusting needle which is installed inside the elasticity needle guide plate. The elasticity thrusting needle is connected to the PCB circuit board at the bottom. Upon the testing of the testing socket, the focal plane assembly is secured to the heat conduction pedestal via a locking mechanism such as a screw. Soft metal is arranged between the heat conduction pedestal and the assembly for heat transmission. Under the action of elastic force of a spring, the needle pin of the focal plane assembly and the elasticity thrusting needle maintain a certain contact force without damage to the needle pin. The testing socket is compact in structure and easy to manufacture, can implement cooling of the focal plane assembly via the heat conduction pedestal, and is applicable to refrigeration testing of the high-density needle pin assembly.

Description

technical field [0001] The invention relates to a socket, in particular to an elastic test socket for low-temperature applications, and is especially suitable for cooling tests of high-density focal plane components or heat dissipation tests of high-power consumption components. Background technique [0002] The miniaturization and integration of infrared focal plane components has become one of the development directions of infrared detectors. Infrared focal plane components will generate Joule heat during operation, and many infrared detectors need to work at low temperatures. The components need to be placed during testing. The test is carried out in a dedicated test dewar or refrigeration chamber, and the lead interconnection is completed by using pin welding wires or pins. Pin network array package (PGA) and dual in-line package (DIP) are relatively common packaging forms. With the improvement of integration, the pitch of pins is often only 1.27mm or smaller, and the nu...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a test socket which is convenient for low-temperature testing of high-density pin components. Damaged components etc.

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