Elasticity testing socket for low-temperature application

A technology of elasticity testing and low temperature application, applied in the field of sockets, it can solve the problems of easily damaged components and heavy workload, and achieve the effects of good compatibility, convenient application and reliable electrical connection.

Inactive Publication Date: 2015-12-09
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a test socket which is convenient for low-temperature testing of high-density pin components. Damaged components etc.

Method used

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  • Elasticity testing socket for low-temperature application
  • Elasticity testing socket for low-temperature application
  • Elasticity testing socket for low-temperature application

Examples

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Embodiment Construction

[0012] The invention provides a specific application example of an elastic test socket for low temperature applications, see Figure 1 ~ Figure 4 , including a heat conduction base 1, a PCB circuit board 2, an elastic pin 3, an elastic pin guide plate 4, a positioning pin 5, an assembly pin guide plate 6 and a focal plane assembly 7. The focal plane assembly 7 is a PGA structure with a pin spacing of 1.27 mm, and a mounting flange on the outside, which can be fixed by four screws 8 . The heat conduction base 1 is made of red copper material. The middle of the heat conduction base 1 is a cold platform, and there are 4 component installation pillars around it. The surface of the installation pillars must be on the same plane as the cold platform. Both the elastic needle guide plate 4 and the component needle guide plate 6 are made of polyamide insulating material, and a cavity is provided at the corresponding position of the intermediate cooling platform. The pin is inserted in...

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PUM

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Abstract

Provided is an elasticity testing socket for low-temperature application. The elasticity testing socket includes a heat conduction pedestal, a PCB circuit board, an elasticity thrusting needle, an elasticity needle guide plate and an assembly needle guide plate, and other parts. The elasticity needle guide plate and the assembly needle guide plate achieve precise alignment via a positioning pin. A pin of a focal plane assembly inserts the assembly needle guide plate and subsequently is in contact with the elasticity thrusting needle which is installed inside the elasticity needle guide plate. The elasticity thrusting needle is connected to the PCB circuit board at the bottom. Upon the testing of the testing socket, the focal plane assembly is secured to the heat conduction pedestal via a locking mechanism such as a screw. Soft metal is arranged between the heat conduction pedestal and the assembly for heat transmission. Under the action of elastic force of a spring, the needle pin of the focal plane assembly and the elasticity thrusting needle maintain a certain contact force without damage to the needle pin. The testing socket is compact in structure and easy to manufacture, can implement cooling of the focal plane assembly via the heat conduction pedestal, and is applicable to refrigeration testing of the high-density needle pin assembly.

Description

technical field [0001] The invention relates to a socket, in particular to an elastic test socket for low-temperature applications, and is especially suitable for cooling tests of high-density focal plane components or heat dissipation tests of high-power consumption components. Background technique [0002] The miniaturization and integration of infrared focal plane components has become one of the development directions of infrared detectors. Infrared focal plane components will generate Joule heat during operation, and many infrared detectors need to work at low temperatures. The components need to be placed during testing. The test is carried out in a dedicated test dewar or refrigeration chamber, and the lead interconnection is completed by using pin welding wires or pins. Pin network array package (PGA) and dual in-line package (DIP) are relatively common packaging forms. With the improvement of integration, the pitch of pins is often only 1.27mm or smaller, and the nu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/02
Inventor 莫德锋刘大福贺香荣
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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