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Aluminum-copper explosion cladding CPU cooling fin device

A heat sink, copper-aluminum technology, applied in the direction of instruments, electrical digital data processing, digital data processing parts, etc., can solve the problems of high cost and low bonding strength of copper-aluminum composite heat sinks, and achieve the goal of not being easy to delaminate and crack, High composite strength and good heat dissipation effect

Inactive Publication Date: 2015-12-09
成都佰世成科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this copper-aluminum composite heat sink has high cost and low bonding strength.

Method used

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  • Aluminum-copper explosion cladding CPU cooling fin device

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Embodiment

[0020] This embodiment includes a fan 1, heat dissipation fins 2, heat dissipation copper plate 3, explosive composite layer 4, heat conduction silica gel 5, CPU6, the heat dissipation copper plate 3 is arranged directly above the CPU6, and the thickness of the heat dissipation copper plate 3 is 8-10mm. Both sides of the lower end of the heat dissipation copper plate 3 are provided with arc-shaped slots 7, between the heat dissipation copper plate 3 and the CPU 6 are filled with heat-conducting silica gel 5, and directly above the heat dissipation copper plate 3 are provided with heat dissipation fins 2, and the heat dissipation fins 2 include heat dissipation fin seats 8, heat dissipation The fins 9 and the heat dissipation fins 9 are uniformly and vertically arranged on the heat dissipation fin base 8, the heat dissipation fin base 8 is an aluminum plate, and the thickness of the heat dissipation fin base 8 is 3-5 mm. The heat dissipation fins 9 include straight fins 10 and b...

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Abstract

The invention belongs to the technical field of CPU cooling, and discloses an aluminum-copper explosion cladding CPU cooling fin device. The aluminum-copper explosion cladding CPU cooling fin device comprises a fan, a cooling fin, a cooling copper plate, an explosion cladding layer, heat conduction silica gel and a CPU. The cooling copper plate is arranged over the CPU, arc notches are formed in the two sides of the lower end of the cooling copper plate, and the space between the cooling copper plate and the CPU is filled with the heat conduction silica gel. The cooling fin is arranged over the cooling copper plate and comprises a cooling fin base and cooling fin bodies, the cooling fin bodies are evenly and perpendicularly arranged on the cooling fin base, and the cooling fin base is an aluminum plate. The cooling fin bodies comprise the straight fin bodies and the forked fin bodies, and the forked fin bodies are arranged among the straight fin bodies. Each forked fin body comprises two upper short fin bodies and a lower long fin body, wherein the short fin bodies are symmetrically arranged above the long fin body. The explosion cladding layer is arranged between the cooling copper plate and the cooling fin base. The fan is arranged above the cooling fin and blows air towards the cooling fin. The aluminum-copper explosion cladding CPU cooling fin device is high in bonding strength and good in cooling effect.

Description

technical field [0001] The invention belongs to the technical field of CPU heat dissipation, and in particular relates to a copper-aluminum explosive composite CPU heat sink device. Background technique [0002] The increase in the number of CPU transistors improves the execution efficiency of the processor, but it also leads to a linear increase in its power consumption and heat generation. If the heat dissipation problem cannot be effectively solved, the stability of the system will be seriously affected, which will become a major bottleneck hindering the development of the CPU. At present, there are three main heat dissipation technologies: air-cooled heat dissipation, heat pipe heat dissipation and water-cooled heat dissipation. Among them, air-cooled heat dissipation has become the most popular technology today because of its simple installation, low cost, obvious heat dissipation effect, strong adaptability, and flexible product replacement. The mainstream of heat dis...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 樊世跃
Owner 成都佰世成科技有限公司
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