Visible light communication led devices

A technology for LED devices and visible light communication, applied in the field of visible light communication, can solve the problem that the system performance needs to be further improved, and achieve the effect of improving the response time and improving the composite rate.

Active Publication Date: 2018-06-19
SOUTH CHINA NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this stage, visible light communication is mostly in the experimental stage. Although the overall system has been realized, there is still a certain distance from the practical stage, and the performance of the system needs to be further improved.

Method used

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Embodiment Construction

[0018] The implementation of the present invention will be further described below in conjunction with the accompanying drawings and examples, but the implementation and protection of the present invention are not limited thereto.

[0019] according to figure 1 , figure 2 and image 3 Structure, choose GaN material, use metal organic chemical vapor phase deposition (MOCVD) technology, grow GaN / InGaN material epitaxial wafer, use semiconductor plane process line, prepare four chips (the middle chip is circular), in each chip On the other hand, the ring-shaped metal positive electrode is prepared by evaporation or sputtering, and the material can be Al or graphene. Such as figure 1 , the visible light communication LED device includes four LED chips whose geometric center points overlap and are located on the same plane. The edge of the chip is wound with a ring-shaped metal positive electrode, wherein a first metal ring-shaped positive electrode 111 is provided on the midd...

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Abstract

The invention discloses a visible light communication LED device, comprising four LED chips of which the geometric centers are overlapped and positioned on the same plane. The four LED chips are a first annular chip, a second annular chip, a third annular chip and a center chip from outside to inside. The edge of each chip is coiled with an annular metal positive electrode. The bottom surface of the visible light communication LED device, namely an n-type bottom surface of each chip, is connected with a device negative electrode. The device negative electrode is circular and positioned on a device bottom. A device annular positive electrode is connected on the edge of the device negative electrode and is mutually insulated with the device negative electrode. The metal annular positive electrode structure is formed on an annular or circular chip; recombination of electrons and hole carriers of a luminescent layer (quantum well layer) is enabled to be uniform; the recombination rate is effectively increased, and the response time of the visible light LED device is shortened; the visible light annular LED device can be made into a power type device of 1W; and the visible light communication LED device is suitable for being applied to the application field of LED lamps.

Description

technical field [0001] The invention relates to the technical field of visible light communication, in particular to a visible light communication LED device. Background technique [0002] Visible light communication technology has become a new field of LED application. Many foreign countries attach importance to the application of this technology. Japan established the "Visible Light Communication Alliance", and the United States launched a 10-year "smart lighting" project. At this stage, visible light communication is mostly in the experimental stage. Although the overall system has been realized, there is still a certain distance from the practical stage, and the performance of the system needs to be further improved. [0003] White LED has the characteristics of short response time and high-speed modulation, which makes white LED expand from the lighting field to the communication field, and can realize the dual functions of lighting and communication at the same time, r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/20H01L33/38H01L27/15
CPCH01L27/153H01L33/20H01L33/385
Inventor 孙慧卿黄涌郭志友
Owner SOUTH CHINA NORMAL UNIVERSITY
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