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Heat radiation device, electronic equipment and manufacturing method

A technology of a heat dissipation device and a manufacturing method, applied in the electronic field, can solve the problems of poor heat dissipation effect of the heat dissipation device, and achieve the effects of improving system performance and reliability, and improving heat conduction and heat dissipation capability.

Inactive Publication Date: 2015-12-23
PHICOMM (SHANGHAI) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a heat sink, electronic equipment and a manufacturing method to solve the technical problem of poor heat dissipation effect of existing heat sinks

Method used

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  • Heat radiation device, electronic equipment and manufacturing method
  • Heat radiation device, electronic equipment and manufacturing method
  • Heat radiation device, electronic equipment and manufacturing method

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Embodiment Construction

[0021] The technical solutions of the present invention will be further described in more detail in conjunction with the accompanying drawings and specific embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] figure 1 It is a schematic structural diagram of a heat dissipation device in an embodiment of the present invention. As shown in the figure, the embodiment of the present invention provides a heat dissipation device, which includes a PCB board 20 , a first heat conduction pad 30 , a second heat conduction pad 40 , a heat conduction column 50 and a heat sink 60 .

[0023] Wherein, the heat dissipation device of the present invention can be widely used in various types of circuits ...

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Abstract

The invention discloses a heat radiation device. The heat radiation device comprises a PCB, a heat conduction pad, heat conduction columns and heat radiation fins, wherein the first surface of the PCB is provided with welding pins of electronic elements and a first heat conduction pad, the second surface of the PCB is provided with a copper foil and a second heat conduction pad, through holes penetrating through the PCB are arranged below the first heat conduction pad of the PCB, the heat conduction columns are arranged in the through holes, one ends of the heat conduction columns are connected with the first heat conduction pad, the other ends of the heat conduction columns are connected with the second heat conduction pad, and the heat radiation fins are arranged on the second heat conduction pad. The invention further discloses a manufacturing method for the heat radiation device. According to the heat radiation device, through structure design of the heat conduction columns penetrating through the PCB and the heat conduction pads, heat conduction and radiation capability of the heat radiation device is improved, system performance and reliability of electronic equipment are improved.

Description

technical field [0001] The invention relates to the field of electronics, in particular to a heat dissipation device, electronic equipment and a manufacturing method. Background technique [0002] With the rapid development and maturity of integrated circuits, the functions of electronic devices are becoming more and more powerful, and at the same time, the volume of electronic devices is becoming smaller and smaller. When electronic equipment works under high load for a long time, it will generate a large amount of heat, which will cause the internal temperature of the equipment to rise rapidly and continue to maintain a high temperature. If it is too high, the working performance will decrease or even fail, which will reduce the system performance and reliability of the entire electronic equipment. Therefore, how to improve the heat dissipation capability of the electronic equipment, especially the PCB (Printed Curcuit Board, printed circuit board) board thereof, has beco...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 范亚妮
Owner PHICOMM (SHANGHAI) CO LTD
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