A kind of electroplating device and electroplating structure based on tin-silver-copper alloy plating

An electroplating device, tin-silver-copper technology, applied in the direction of plating tank, electrolysis process, electrolysis components, etc., can solve the problems of complicated operation and uneven coating, and achieve the effect of convenient operation, smooth coating and enhanced electroplating effect

Active Publication Date: 2018-04-20
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the existing electroplating devices for tin-silver-copper alloy plating generally use fixed electrodes or other more complicated electroplating structures, which often lead to problems such as uneven coating or complicated operation.

Method used

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  • A kind of electroplating device and electroplating structure based on tin-silver-copper alloy plating

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Embodiment Construction

[0021] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only the technical solutions of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0022] Attached below figure 1 , which is a structural schematic diagram of an electroplating structure based on tin-silver-copper alloy plating provided by an embodiment of the present invention, and describes the embodiment provided by the present invention in detail.

[0023] An electroplating device based on tin-silver-copper alloy plating, compri...

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Abstract

The invention relates to an electroplating device and an electroplating structure based on tin-silver-copper alloy plating, including an electroplating tank and a control system. The system includes a rotation speed controller, and the rotation speed controller controls the rotation of the electrode rotating mechanism so as to drive the plated parts to rotate inside the area surrounded by the tin layer. It can be seen that the electroplating device and electroplating structure based on tin-silver-copper alloy plating do not need to install a stirring device, only the static electrode of the traditional electroplating equipment is converted into a rotating electrode, and a tin layer is set around the inner wall of the electroplating tank, which can be realized during the electroplating process. The rotation of the plated parts effectively eliminates the concentration difference of the electroplating solution and greatly simplifies the structure of the electroplating tank, so that the electroplating process will not appear in the turbulent state of the electrolyte flow, thereby enhancing the electroplating effect and making the coating more even and uniform. And the structure is simple, the operation is convenient, and the implementability is strong.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating device and an electroplating structure based on tin-silver-copper alloy plating. Background technique [0002] In recent years, the problem of lead pollution in groundwater has become increasingly serious due to the dissolution of lead in the soldering material—Sn-Pb alloy in waste electronic products. With the enhancement of people's awareness of environmental protection, banning the use of lead in the electronic assembly industry has been put on the agenda. Now, the "Administrative Measures for the Control of Pollution by Electronic Information Products" jointly formulated by the Ministry of Information Industry and the State Environmental Protection Administration in my country clearly stipulates that the use of lead and other six toxic and harmful substances in electronic information products is prohibited or restricted. Therefore, in order to better...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/02C25D21/12
Inventor 孙蓉纪亚强谢金麒符显珠
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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