Air blade and wet processing apparatus having the same

Abstract

The invention, which relates to the wet processing equipment field, discloses an air blade comprising an air inlet part and an air outlet part. The air inlet part and the air outlet part are communicated. The air inlet part is provided with an air intake. The air outlet part is provided with a plurality of air exhaust channels and each air exhaust channels is inclined towards the horizontal plane; and included angles between the air exhaust channels and the horizontal plane are inclined angles of the air exhaust channels, wherein the inclined angles of the air exhaust channels are not identical completely. Air is exhausted out of the air blade by the air exhaust channels. In addition, the invention also discloses a wet processing apparatus having the air blade. According to the air blade, the air intake pressure and the blast capacity demand are proper; airflow structure is designed reasonably; and the air exhaust can be carried out uniformly and the air is sprayed at different angles, so that a phenomenon of cracking of a silicon wafer or water stain existence due to uneven force application can be prevented.

Description

technical field [0001] The invention relates to the field of wet process equipment, in particular to an air knife and a wet processing device with the air knife. Background technique [0002] In the production process of solar cells, after chemical wet treatment and cleaning of solar cells, silicon wafers need to be dried for subsequent operations. [0003] In the traditional method, it is necessary to put silicon wafers into silicon wafer boxes and put them into a dryer for drying. The production efficiency is low and it is not suitable for horizontal wet processing. [0004] The air knife structure used in the existing horizontal wet treatment equipment has the following problems: one is to use compressed air to dry, which needs to consume clean compressed air all the time, and the cost is high; the other is to use the air knife supplied by a general high-pressure fan , but due to the unreasonable structure of the existing air knife, there will still be a small amount of...

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Problems solved by technology

[0004] The air knife structure used in the existing horizontal wet treatment equipment has the following problems: one is to use compressed air to dry, which needs to consume clean compressed air all the time, and the cost is high; the other is to use the air knife supplied by a general high-pressure fan , but due to the unreasonable structure of the existing air knife, there will still be a small amount of water remaining on the silicon wafer after the air knife blowing treatment. In order to remove the residual water, it is necessary to increase the air pressure and flow, which will easily cause the silicon wafer to break. Fragmentation rate rises

[0005] In the prior art, there is no fan with a reasonable structure, which can not only ensure that the silicon wafer will not break, but also completely remove the moisture on the silicon wafer under the premise of moderate pressure and air volume requirements.

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