Quantum dot light-emitting diode (LED) structure and encapsulating method thereof
A technology of LED packaging and quantum dots, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., to achieve the effects of wide application, improved light energy utilization rate, and uniform color space distribution
Active Publication Date: 2016-01-06
南昌易美光电科技有限公司
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Problems solved by technology
It cleverly avoids the problem that quantum dot materials need to be dissolved in silica gel, and at the same time solves the problem of oxygen and moisture insulation of quantum dot materials, so that quantum dot materials can be applied in a simple and efficient way
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[0039] The specific implementation of a quantum dot LED packaging structure and method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.
[0040] The quantum dot LED packaging involved in this patent does not use brackets combined with flip-chip packaging, and the process is also different from the traditional LED packaging process. Its main technical idea is to carry out the operation mode opposite to the traditional LED packaging process, and use a combination of glass, organic materials and ceramics to encapsulate quantum dots to isolate oxygen and water vapor in the air. The specific package structure is as figure 1 As shown, the quantum dot LED packaging structure includes: a glass substrate (the glass substrate contains all high light transmittance materials that can be used for oxygen and moisture barriers.), quantum dots on the glass substrate, solids on the quantum dots Crystal glue (the crystal glue in...
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The invention discloses a quantum dot light-emitting diode (LED) structure, which comprises a glass substrate, quantum dots on the glass substrate, solid crystal gel on quantum dots, an LED chip on the solid crystal gel and two electrodes on the LED chip, wherein the solid crystal gel covers all exposed parts of the quantum dots and exposed partial surface of the glass substrate; an organic thin film covers all exposed surface of the solid crystal gel, the side surfaces of the LED chip and the exposed partial surface of the glass substrate; an inorganic thin film covers the organic thin film; and reflecting white glue covers the inorganic thin film. By an encapsulating method, a wide application of the quantum dot material on an LED becomes possible; and a bracket or a gold wire does not need to be used in related encapsulation. Compared with the encapsulation form with the same properties, the cost is saved by over 20%; and applications of the LED in various fields, especially the fields of commercial lighting and civil lighting, are relatively wide.
Description
technical field [0001] The invention relates to a quantum dot LED packaging structure and method, which are mainly used in backlight, lighting, Flash and other products, and belong to the application field of semiconductor lighting. Background technique [0002] At present, the technical solution commonly used commercially for white light LEDs is to use blue light chips with phosphors that emit red, green, and yellow. Due to the limitation of the structure, the emission spectrum range is wide, the monochromaticity is poor, the color gamut can only reach 72% NTSC, and the color reduction ability is weak. Therefore, in order to obtain a higher color gamut, a quantum dot material with a narrower emission spectrum must be used, and its half-peak width can usually be less than 35nm. The color gamut value of a high color gamut LCD TV using quantum dot materials as a backlight source can reach 110% NTSC. At present, the three major manufacturers of quantum dot materials in the wo...
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IPC IPC(8): H01L33/48H01L33/50H01L33/56
CPCH01L33/486H01L33/502H01L33/56H01L2933/0041H01L2933/005
Inventor 申崇渝张俊福
Owner 南昌易美光电科技有限公司