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A Process for Plugging Holes with Solder Resist Ink on Printed Circuit Board

A technology of printed circuit board and solder resist ink, which is applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc. It can solve the problem that the plug hole of the circuit board is not full, the ink is easy to adhere to the hole, and the ink is hindered from entering the hole, etc. problem, to avoid blockage

Inactive Publication Date: 2018-06-15
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that the drilling aperture of the existing printed circuit board plugging process is consistent with the aperture of the hole to be plugged. One side of the board is silk-screened once. For circuit boards with relatively large thickness and diameter, the defects of plug holes are not full and the holes are red, which will affect the subsequent surface treatment and welding processes; thus a plug hole is accurate and not easy to appear. Printed Circuit Board Solder Resist Ink Plugging Technology with Not Full and Red Orifice Defects

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] This embodiment provides a printed circuit board solder resist ink plugging process, which includes the following steps:

[0025] S1. Drill a hole on the aluminum sheet corresponding to the hole to be plugged. The diameter of the drilled hole is 8% smaller than that of the hole to be plugged. Stick the aluminum sheet to the screen, and fix the screen to the screen printing machine with clips ;

[0026] S2. Perform two consecutive screen printing solder resist inks on one side of the printed circuit board, the viscosity of the solder resist ink is 400dPa·s, and the screen printing pressure for the first silk screen printing is 4kg / cm 2 , the screen printing speed is 1.5m / min; the screen printing pressure of the second screen printing is 3kg / cm 2 , the screen printing speed is 2.5m / min, and the screen printing angle of the two screen printings is 8°;

[0027] S3. Perform two consecutive screen printing solder resist inks on the other side of the printed circuit board, t...

Embodiment 2

[0030] The invention provides a process for plugging holes with solder resist ink on a printed circuit board, which comprises the following steps:

[0031] S1. Drill a hole on the aluminum sheet corresponding to the hole to be plugged. The diameter of the drilled hole is 9% smaller than that of the hole to be plugged. Stick the aluminum sheet to the screen, and fix the screen to the screen printing machine with clips ;

[0032] S2. Perform two consecutive screen printing solder resist inks on one side of the printed circuit board, the viscosity of the solder resist ink is 500dPa·s, and the screen printing pressure for the first silk screen printing is 5kg / cm 2 , the screen printing speed is 2m / min; the screen printing pressure of the second screen printing is 4kg / cm 2 , the screen printing speed is 3m / min, and the screen printing angle of the two screen printings is 10°;

[0033] S3. Perform two consecutive screen printing solder resist inks on the other side of the printed ...

Embodiment 3

[0036] The invention provides a process for plugging holes with solder resist ink on a printed circuit board, which comprises the following steps:

[0037] S1. Drill a hole on the aluminum sheet corresponding to the hole to be plugged. The diameter of the drilled hole is 10% smaller than that of the hole to be plugged. Stick the aluminum sheet on the screen, and fix the screen on the screen printing machine through a clip ;

[0038] S2. Perform two consecutive screen printing solder resist inks on one side of the printed circuit board, the viscosity of the solder resist ink is 550dPa·s, and the screen printing pressure for the first silk screen printing is 6kg / cm 2 , the screen printing speed is 2.5m / min; the screen printing pressure of the second screen printing is 5kg / cm 2 , the screen printing speed is 3.5m / min, and the screen printing angle of the two screen printings is 12°;

[0039] S3. Perform two consecutive screen printing solder resist inks on the other side of the...

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Abstract

The invention discloses a plugging hole process of solder resist ink of a printed circuit board. The process comprises the following steps that: S1, drilling is carried out at a position corresponding to a to-be-plugged-hole on an aluminium sheet; S2, solder resist ink silk-screen processing is carried out on one side of a printed circuit board twice continuously; S3, solder resist ink silk-screen processing is carried out on the other side of the printed circuit board twice continuously; and S4, post procedures are carried out. According to the invention, silk-screen processing is carried out on each of the two sides twice and the first silk-screen pressure is larger than the second silk-screen pressure and the first silk-screen speed is smaller than the second silk-screen speed, so that ink during the first hole plugging can flow into the hole smoothly. During the second silk-screen process, time for entrance into the to-be-plugged hole by first ink is provided and the second silk-screen process is used as the compensating silk-screen process to compensate the plugged hole at the backs side, so that a problem that the plugging hole ink can not enter the plugged hole deep for the thick circuit board with the ratio of thickness to radial dimension larger than or equal to 15:1 when hole plugging is carried out only once can be effectively solved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to a process for plugging holes with solder resist ink on a printed circuit board. Background technique [0002] Printed circuit board (PCB) via holes are generally used to realize the conduction between the layers of the circuit board. With the development of electronic products in the direction of "light, thin, short and small", the density of PCB is also increasing. High, and with the development of packaging technology such as SMT, the installation requirements for components are very high during production. If there is no dirt, it is necessary to perform circuit board solder resist ink plugging treatment. Specifically, before printing the solder resist ink on the entire board, use the solder resist ink to plug the holes that need to be plugged with ink. The solder resist ink plug hole mainly has the following functions: 1. Increase the insu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0094H05K2201/0959
Inventor 王淑怡朱拓阙玉龙王自杰
Owner SHENZHEN SUNTAK MULTILAYER PCB
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