A Process for Plugging Holes with Solder Resist Ink on Printed Circuit Board
A technology of printed circuit board and solder resist ink, which is applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc. It can solve the problem that the plug hole of the circuit board is not full, the ink is easy to adhere to the hole, and the ink is hindered from entering the hole, etc. problem, to avoid blockage
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Embodiment 1
[0024] This embodiment provides a printed circuit board solder resist ink plugging process, which includes the following steps:
[0025] S1. Drill a hole on the aluminum sheet corresponding to the hole to be plugged. The diameter of the drilled hole is 8% smaller than that of the hole to be plugged. Stick the aluminum sheet to the screen, and fix the screen to the screen printing machine with clips ;
[0026] S2. Perform two consecutive screen printing solder resist inks on one side of the printed circuit board, the viscosity of the solder resist ink is 400dPa·s, and the screen printing pressure for the first silk screen printing is 4kg / cm 2 , the screen printing speed is 1.5m / min; the screen printing pressure of the second screen printing is 3kg / cm 2 , the screen printing speed is 2.5m / min, and the screen printing angle of the two screen printings is 8°;
[0027] S3. Perform two consecutive screen printing solder resist inks on the other side of the printed circuit board, t...
Embodiment 2
[0030] The invention provides a process for plugging holes with solder resist ink on a printed circuit board, which comprises the following steps:
[0031] S1. Drill a hole on the aluminum sheet corresponding to the hole to be plugged. The diameter of the drilled hole is 9% smaller than that of the hole to be plugged. Stick the aluminum sheet to the screen, and fix the screen to the screen printing machine with clips ;
[0032] S2. Perform two consecutive screen printing solder resist inks on one side of the printed circuit board, the viscosity of the solder resist ink is 500dPa·s, and the screen printing pressure for the first silk screen printing is 5kg / cm 2 , the screen printing speed is 2m / min; the screen printing pressure of the second screen printing is 4kg / cm 2 , the screen printing speed is 3m / min, and the screen printing angle of the two screen printings is 10°;
[0033] S3. Perform two consecutive screen printing solder resist inks on the other side of the printed ...
Embodiment 3
[0036] The invention provides a process for plugging holes with solder resist ink on a printed circuit board, which comprises the following steps:
[0037] S1. Drill a hole on the aluminum sheet corresponding to the hole to be plugged. The diameter of the drilled hole is 10% smaller than that of the hole to be plugged. Stick the aluminum sheet on the screen, and fix the screen on the screen printing machine through a clip ;
[0038] S2. Perform two consecutive screen printing solder resist inks on one side of the printed circuit board, the viscosity of the solder resist ink is 550dPa·s, and the screen printing pressure for the first silk screen printing is 6kg / cm 2 , the screen printing speed is 2.5m / min; the screen printing pressure of the second screen printing is 5kg / cm 2 , the screen printing speed is 3.5m / min, and the screen printing angle of the two screen printings is 12°;
[0039] S3. Perform two consecutive screen printing solder resist inks on the other side of the...
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