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Piezoelectric driven high precision lead wire clamp

A piezoelectric driven, high-precision technology, used in decorative arts, gaseous chemical plating, microstructure technology, etc., can solve the problems of difficult to stabilize and control the clamping force, complex force calibration process, etc., to achieve the realization of the clamping force. The effect of measurement and feedback, reducing overall mass and motion inertia, and improving stability

Active Publication Date: 2017-10-17
TIANJIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods will be affected by inertial force during the movement process, it is difficult to accurately ensure the stability and controllability of the clamping force, and the force calibration process is more complicated

Method used

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  • Piezoelectric driven high precision lead wire clamp
  • Piezoelectric driven high precision lead wire clamp
  • Piezoelectric driven high precision lead wire clamp

Examples

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Embodiment Construction

[0016] In order to further understand the invention content, characteristics and effects of the present invention, the following examples are given, and detailed descriptions are as follows in conjunction with the accompanying drawings:

[0017] see Figure 1 to Figure 5 , a piezoelectric-driven high-precision lead clamp, which is integrally formed by plate wire cutting, and includes a bridge-type displacement amplification mechanism 4 and a base body 1, and the bridge-type displacement amplification mechanism 4 and the base body 1 are both Arranged symmetrically with respect to the center line of the clamp, the base body 1 is formed on both sides of the movable end of the bridge-type displacement amplifying mechanism 4 .

[0018] The bridge-type displacement amplifying mechanism 4 is provided with a fixed beam 4-4 parallel to the substrate 1, a movable beam 4-5, and two bridges connecting the fixed beam 4-4 and the movable beam 4-5. The four-bar linkage mechanism 4-1, the fo...

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Abstract

The invention discloses a piezoelectric-driven high-precision lead wire clip. The wire clip is integrally formed by wire cutting of a plate, and includes a bridge-type displacement amplification mechanism and a base body. The base body is formed on both sides of the movable end of the bridge-type displacement amplification mechanism. Side; the bridge-type displacement amplifying mechanism is provided with a fixed beam parallel to the substrate, a movable beam and two four-bar linkages connecting them, and a flexible parallel double-plate mechanism connected to the substrate is formed at both ends of the movable beam; A piezoelectric ceramic driver is provided between the fixed beam and the movable beam; two parallelogram mechanisms are formed on one side of the substrate, and a connecting beam perpendicular to it is formed on the output end of the parallelogram mechanism, and a connecting beam is formed on the connecting beam. There are jaws; the output end of the bridge-type displacement amplifying mechanism is connected with the input end of the parallelogram mechanism through a flexible hinge III. The invention has the advantages of small volume, compact structure, stable and reliable clamping force, low manufacturing cost and large displacement magnification.

Description

technical field [0001] The invention belongs to the field of micro-device packaging, in particular to a piezoelectric-driven high-precision lead clip. Background technique [0002] In recent years, with the vigorous development of the microelectronics industry, the development of the microelectronics industry has become an important symbol to measure the comprehensive strength of a country, and an important guarantee to promote the sustainable development of the national economy and the security of the national strategic basic industry. With the continuous development of the microelectronics industry, devices in related industries are constantly developing towards miniaturization, high performance and high integration, and the quality requirements for packaging products are becoming more and more stringent. Therefore, more requirements are put forward for the quality and efficiency of micro device packaging. high demands. [0003] The so-called micro-device packaging is to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00
Inventor 梁存满王福军田延岭张大卫
Owner TIANJIN UNIV
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