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Power system-on-chip architecture

A monolithic integration, flip-chip technology, applied in cooling/heating devices of lighting devices, outdoor lighting, lighting and heating equipment, etc., can solve problems such as expensive, restricting SSL applications, and large volume

Active Publication Date: 2016-01-20
THE HONG KONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, traditional solid-state lighting has two key problems: relatively expensive and relatively large
These bulky drive circuits severely restrict the application of SSL in compact applications

Method used

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Embodiment Construction

[0019] In general, embodiments of the present invention relate to layered structures. The structure consists of three distinct parts.

[0020] • First, the substrate is used to build signal processing and control circuits as well as power management control circuits. It should be understood that the signal processing and control circuitry and power management control circuitry may be fabricated on the substrate using conventional IC fabrication processes on the substrate front side. These signal processing and control circuits and power management control circuits on the front side of the substrate make up what is referred to herein as the integrated circuit layer.

[0021] • Second, the substrate can provide passive components including inductors, transformers and capacitors, eg on the backside of the substrate. These passive components are embedded on the back side of the substrate and connected to the front side of the substrate (integrated circuit layer) through vias. T...

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PUM

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Abstract

A lighting device is provided. The lighting device includes a substrate, integrated circuits (22', 24), embedded passive components (26, 27), and a lighting component (22), the device being arranged in an architecture having three layers: an integrated circuits layer (11) including the integrated circuits (22', 24), wherein the integrated circuits layer (11) is integrated on a first side of the substrate; an embedded passive components layer (12) including the embedded passive components (26, 27), wherein the embedded passive components (26, 27) are embedded in grooves formed in the substrate and wherein the embedded passive components (26, 27) are connected to the integrated circuits (22', 24) through vias (28) in the substrate; and a bonded layer (13), including the lighting component (22), the lighting component (22) being connected to the integrated circuit layer (11) through flip-chip bonding or monolithic integration.

Description

[0001] Cross References to Related Applications [0002] This patent application claims priority to US Provisional Patent Application No. 61 / 852,933, filed March 25, 2013, which is incorporated herein by reference. technical field [0003] Embodiments of the invention relate to power system-on-chip architectures. Specifically, architectures and platforms integrating solid-state lighting, signal processing, control circuits, semiconductor power switches, and passive components are discussed along with exemplary applications. Background technique [0004] Solid state lighting (SSL) technologies such as light emitting diodes (LEDs) have broad prospects in light source, lighting and display applications. The use of SSL can significantly reduce electricity consumption costs, replacement costs and maintenance costs due to higher efficiency and longer life compared to traditional fluorescent and fluorescent lamps. In addition, by using signal processing and control circuits to di...

Claims

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Application Information

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IPC IPC(8): H01L25/16H01L33/48H05B44/00
CPCH01L25/16H01L25/167H01L27/156H01L33/62H01L2224/16F21V5/004F21V9/00Y02B20/40H05B47/195H05B45/10H05B47/105H01L33/52H05B47/11F21V29/70F21Y2115/10F21W2131/103G08G1/07H01L21/486H01L23/49827H01L25/0753H01L27/153H01L33/0075H01L33/32H01L33/54H01L33/58H01L33/642H01L2933/005H01L2933/0058H01L2933/0066H01L2933/0075
Inventor 俞捷单建安刘纪美
Owner THE HONG KONG UNIV OF SCI & TECH