Single-room multi-electrode type PECVD (plasma enhanced chemical vapor deposition) reaction chamber

Abstract

The invention provides a single-room multi-electrode type PECVD (plasma enhanced chemical vapor deposition) reaction chamber which comprises a vacuum chamber, wherein the vacuum chamber is externally connected with a vacuum gas exhaustion system and a vacuum detection system; a series of grounding electrode boards, high-frequency electrode boards and substrate racks for placing substrates, which are alternatively arranged, are arranged inside the vacuum chamber; in order to guarantee the film layer quality, a reaction gas uniform distribution device and a substrate heater are arranged in the vacuum chamber; and the types of reaction gases are determined by a film coating process. The single-room multi-electrode type PECVD reaction chamber adopts a multi-electrode structure, effectively improves the PECVD film coating efficiency and sufficiently considers various factors that affect the PECVD film forming quality. Besides, by virtue of an integrated design, the substrate racks and the gas distribution system are respectively integrated on the electrode boards, so that the structure of the reaction chamber is greatly simplified while requirements of the PECVD film coating process are met.

Description

technical field [0001] The invention relates to a single-chamber multipolar PECVD reaction chamber structure, belonging to the field of vacuum equipment, especially vacuum coating equipment. Background technique [0002] Plasma-enhanced chemical vapor deposition (PECVD) is a low-temperature plasma surface deposition technology. Its main characteristics are as follows: it only acts on the surface of the material, and the surface of the material is usually only on the order of a few microns or nanometers. The main performance of the material is greatly affected. Small; compared with the traditional wet surface treatment method, it has the advantages of cleanness, environmental protection and energy saving; it can obtain some deposition effects that cannot be obtained by other methods, expand the application field of some materials, and improve its use value. Therefore, low-temperature plasma surface deposition technology has received more and more attention in recent years. ...

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Problems solved by technology

However, this kind of industrial equipment has a large plasma range and complex internal structure. If the air is fed from a direction parallel to the plate surface, it will cause the problem of uneven air distribution in the coating area, which will further affect the film quality.

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