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Transverse MEMS acceleration sensitive chip and manufacturing process thereof

A technology of lateral acceleration and sensitive chips, applied in the field of sensors, can solve the problems of low precision lithography and etching, achieve high sensitivity, reduce manufacturing costs, and reduce manufacturing costs

Active Publication Date: 2016-01-27
INST OF GEOLOGY & GEOPHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the key process of the flat accelerometer is the bonding process, and its accuracy is lower than that of the key process of the comb accelerometer, lithography and etching.

Method used

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  • Transverse MEMS acceleration sensitive chip and manufacturing process thereof
  • Transverse MEMS acceleration sensitive chip and manufacturing process thereof
  • Transverse MEMS acceleration sensitive chip and manufacturing process thereof

Examples

Experimental program
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Embodiment Construction

[0095] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0096] refer to figure 1 and figure 2 According to a MEMS lateral acceleration sensitive chip provided by the present invention, it comprises: a frame 1, a mass block 2 arranged in the frame, and an elastic beam 3 for connecting the frame 1 and the mass block 2, which It is characterized in that a first connecting portion 21 and a plurality of recessed portions 22 are formed on the mass block 2 , and a second connecting portion 12 is formed on the frame 1 . Wherein, the first connecting portion 21 is located above the recessed portion 22 . The elastic beam 3 connects the first connecting portion 21 and the second connecting portion 12 ; multiple sets of comb structures 4 are arranged in the recessed portion 22 .

[0097] refer to figure 2 , preferably, the first connecting portion 21 is I-shaped, which includes a plurality of transverse tooth pivots 211 and a lo...

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PUM

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Abstract

A transverse MEMS acceleration sensitive chip comprises a frame, a mass block arranged in the frame, and an elastic beam connected to the frame and the mass block. The mass block is equipped with multiple recesses and a first connecting part. The frame is equipped with second connecting part. The elastic beam is connected to the first connecting part and the second connecting parts. Multiple comb-tooth structures are disposed above the recesses. Each comb-tooth structure comprises movable comb teeth extending from the first connecting part and fixed comb teeth extending from the corresponding second connecting parts. A movable gap is formed between each movable comb tooth and each corresponding fixed comb tooth, and differential detection capacitance is formed by means of the movable gap. The transverse acceleration sensitive chip organically combines the advantages of both a flat type accelerometer and a comb tooth type accelerometer, has a large mass block, and is high in capacitance, low in damping and high in sensitivity.

Description

technical field [0001] The invention relates to the field of sensors, in particular to an acceleration sensitive chip, a manufacturing process of the sensitive chip and an accelerometer with the sensitive chip. Background technique [0002] Today, accelerometers are used in many applications, such as measuring the intensity of earthquakes and collecting data, detecting the impact strength of automobile collisions, and detecting the angle and direction of tilt in mobile phones and game consoles. With the continuous advancement of microelectromechanical systems (MEMS) technology, many small accelerometers at the nanometer level have been widely used commercially. [0003] Today's acceleration sensitive chips are divided into two types, one is flat type, such as the Chinese invention patent with publication number CN102768290A, the flat type acceleration sensitive chip relies on the connection between the upper cover plate, the mass block and the lower cover plate after power-o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01P15/125B81B3/00B81C1/00
Inventor 于连忠矣雷阳孙晨
Owner INST OF GEOLOGY & GEOPHYSICS CHINESE ACAD OF SCI