Semiconductor substrate heat treatment device

A heat treatment device, semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc.
CN105280518AActive Publication Date: 2016-01-27ACM RES SHANGHAI
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
ACM RES SHANGHAI
Publication Date
2016-01-27

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Abstract

The concept of "smart city, smart life" is deeply rooted among people. People also have increasingly high technological requirement for semiconductor products. Acting as an important step of the semiconductor processing procedure, a substrate heat treatment device constantly wins public attention, and ensuring of even heating of a wafer in the heating procedure is always a difficult problem to practitioners. The invention provides a semiconductor substrate heat treatment device comprising an exhaust device and a heating cavity. Nitrogen is filled in the heating cavity in the heating procedure, and heat is indirectly transmitted to the surface of the wafer by nitrogen so that the problem uneven heating caused by warping of the wafer can be eliminated.
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Description

technical field

[0001] The invention relates to the field of semiconductor device processing, more specifically, to a heat treatment device for a semiconductor substrate. Background technique

[0002] The concept of "smart city, smart life" has been deeply rooted in the hearts of the people, and people's demands for precision electronic instruments and integrated circuits are becoming more and more eager. Strong market demand has promoted the prosperity of the semiconductor processing and manufacturing industry, and has also greatly enriched and refined the processing technology of semiconductor devices. Among the various processing techniques, devices for heating wafers have always attracted attention.

[0003] The conventional design of the wafer heat treatment device is: a closed chamber, a heater is arranged in the closed chamber, and the wafer is placed on it for heat treatment, and the heating process can be completed. Using this device to heat-treat the wafer is sim...

Claims

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