Semiconductor substrate heat treatment device

A heat treatment device, semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc.

Active Publication Date: 2016-01-27
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Therefore, the main purpose of the present invention is to provide a device ...

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  • Semiconductor substrate heat treatment device
  • Semiconductor substrate heat treatment device
  • Semiconductor substrate heat treatment device

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Embodiment Construction

[0038] In order to elaborate the spirit of the present invention in detail and help those skilled in the art to practically and comprehensively understand the complete technical solution of the present invention, the following will be described in conjunction with examples and accompanying drawings:

[0039] attached Figure 1-4 Various structural features of specific embodiments of the heat treatment device of the present invention are shown.

[0040] Figure 1-3 The overall display of the wafer heat treatment device of the present invention is carried out. The heat treatment apparatus includes exhaust means and a heating chamber 102 . The exhaust device includes a cuboid exhaust chamber 101 supported by two parallel slide rails 103 and placed above the heating chamber 102 . The two sliding rails 103 are respectively located on two edges below the cuboid exhaust chamber 101 , so that the exhaust chamber 101 can slide along the sliding rails 103 . Further, a circular exhau...

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Abstract

The concept of "smart city, smart life" is deeply rooted among people. People also have increasingly high technological requirement for semiconductor products. Acting as an important step of the semiconductor processing procedure, a substrate heat treatment device constantly wins public attention, and ensuring of even heating of a wafer in the heating procedure is always a difficult problem to practitioners. The invention provides a semiconductor substrate heat treatment device comprising an exhaust device and a heating cavity. Nitrogen is filled in the heating cavity in the heating procedure, and heat is indirectly transmitted to the surface of the wafer by nitrogen so that the problem uneven heating caused by warping of the wafer can be eliminated.

Description

technical field [0001] The invention relates to the field of semiconductor device processing, more specifically, to a heat treatment device for a semiconductor substrate. Background technique [0002] The concept of "smart city, smart life" has been deeply rooted in the hearts of the people, and people's demands for precision electronic instruments and integrated circuits are becoming more and more eager. Strong market demand has promoted the prosperity of the semiconductor processing and manufacturing industry, and has also greatly enriched and refined the processing technology of semiconductor devices. Among the various processing techniques, devices for heating wafers have always attracted attention. [0003] The conventional design of the wafer heat treatment device is: a closed chamber, a heater is arranged in the closed chamber, and the wafer is placed on it for heat treatment, and the heating process can be completed. Using this device to heat-treat the wafer is sim...

Claims

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Application Information

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IPC IPC(8): H01L21/67
Inventor 王文军王晖陈福平方志友
Owner ACM RES SHANGHAI
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