Heat dissipation device and heat dissipation method for non-refrigerated infrared core
A heat dissipation device and non-refrigeration technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problems of increasing the power consumption of infrared cores and reducing the overall performance of non-cooling infrared cores, to achieve Effects of low power consumption, stable operation, and improved stability and reliability
Active Publication Date: 2017-12-26
CHANGCHUN YITIAN TECH CO LTD
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[0004] The uncooled infrared detector 6 integrates a TEC thermoelectric cooler inside the tube shell, and connects it with the temperature signal output by the temperature sensor inside the infrared detector to the TEC control circuit outside the infrared detector, which can realize the control of the uncooled infrared detector. The cooling or heating of the infrared detector 6 keeps the uncooled infrared detector 6 at a stable temperature point, but when the background ambient temperature deviates greatly from the selected temperature, the power consumption of the infrared core will be increased, resulting in a large amount of heat, reducing the overall performance of uncooled infrared cores
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[0034] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0035] Such as figure 1 and figure 2 As shown, the non-refrigerated infrared core cooling device of the present invention mainly includes: a printed circuit board 1, a first heat sink structure 2, a second heat sink structure 3, a plurality of heat conduction hole arrays 4, a plurality of heat conduction aluminum layers 5.
[0036] The uncooled infrared detector 6 is a temperature-sensitive device, and its temperature change directly affects the imaging quality of the uncooled infrared detector 6 . Therefore, it is necessary to do a good heat dissipation design for the uncooled infrared detector 6 shell. Such as figure 1 As shown, two heat sink structures suitable for the uncooled infrared detector 6 are designed. The uncooled infrared detector 6 needs to be far away from heating components, and is usually welded on a separate printed circuit board 1, an...
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The invention discloses a heat dissipation device and a heat dissipation method for a non-cooling infrared core, belonging to the field of non-cooling infrared imaging, and solves the heat dissipation problem of the existing non-cooling infrared core. The heat dissipation method of the present invention includes: designing two heat sink structures suitable for heat dissipation of uncooled infrared detectors, providing heat dissipation paths for infrared detectors; setting a printed circuit board heat dissipation method based on a heat conduction hole array and a heat conduction aluminum layer , providing heat dissipation paths for heating power components; a multi-temperature point thermoelectric cooler (TEC) control method is proposed to achieve low power consumption and stable operation in a wide temperature range. The heat dissipation method of the present invention is used to dissipate heat from the infrared detector and heating power components in the uncooled infrared core, and at the same time, make the unrefrigerated infrared core work stably and reliably within a wide range of temperature differences, improving the efficiency of the infrared machine. The imaging quality of the core prolongs the service life of the infrared core.
Description
technical field [0001] The invention belongs to the technical field of unrefrigerated infrared imaging, and in particular relates to an unrefrigerated infrared core heat dissipation device and a heat dissipation method. Background technique [0002] Infrared cores are developing in the direction of miniaturization, all-weather, long-distance, high-definition, high performance, and low power consumption. Infrared cores are divided into cooling and uncooled infrared cores. Uncooled infrared cores are And the power consumption is small, has been widely used gradually, but the uncooled infrared core also has many shortcomings. [0003] The space of the uncooled infrared core is limited, and the size of the circuit board is small, so the space for the layout of components is very limited. At present, components tend to be miniaturized, highly integrated, and high-frequency, and their heat density has increased significantly. The traditional uncooled infrared core mainly include...
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IPC IPC(8): H01L23/373H01L23/367H01L23/38H05K7/20
Inventor 李国宁张宇
Owner CHANGCHUN YITIAN TECH CO LTD