Underfill material and method of manufacturing semiconductor device using underfill material

An underfill material and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of non-Bingham fluidity, insufficient air removal, etc., and achieve good performance Effect of Solder Bondability

Active Publication Date: 2019-07-16
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the storage elastic modulus G' is usually set below 10E+04Pa, and the loss elastic modulus G" is set at about 10E+03Pa, and the fluidity in the molten state does not show non-Bingham fluidity, so the removal of air during installation is insufficient. Become a mounted body with voids inside

Method used

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  • Underfill material and method of manufacturing semiconductor device using underfill material
  • Underfill material and method of manufacturing semiconductor device using underfill material
  • Underfill material and method of manufacturing semiconductor device using underfill material

Examples

Experimental program
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Embodiment approach

[0067] In addition, this technology can also be applied to TSV (Through Silicon Via: Through Silicon Via) technology that electrically connects a plurality of chip substrates stacked in a sandwich shape by filling a small hole provided in a semiconductor chip with metal.

[0068] That is, it can also be applied to a semiconductor device in which a plurality of chip substrates are stacked having a first surface on which an electrode with solder is formed and a second surface on which a counter electrode opposite to the electrode with solder is formed on the opposite side of the first surface. Manufacturing method.

[0069] In this case, the underfill film is mounted on the second surface of the second chip substrate with the underfill film attached to the first surface side of the first chip substrate. Then, the first surface of the first chip substrate and the second surface of the second chip substrate are thermocompression bonded at a temperature equal to or higher than the ...

Embodiment

[0071]

[0072] Hereinafter, examples of the present invention will be described. In this example, a pre-feed type underfill film was produced, and the dynamic viscoelasticity measurement was performed. Then, an IC chip having electrodes with solder and an IC substrate having electrodes opposed thereto were connected to each other using an underfill film to produce a package, and voids and solder joint states were evaluated. In addition, this invention is not limited to these Examples.

[0073] The dynamic viscoelasticity measurement, fabrication of the package, evaluation of voids, and evaluation of solder joints were performed as follows.

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Abstract

Provided are an underfill material capable of achieving void-free mounting and excellent solder jointability, and a method of manufacturing a semiconductor device using the underfill material. Using an underfill material containing epoxy resin, acid anhydride, acrylic resin and organic peroxide, exhibits non-Bingham fluidity at any temperature between 60°C and 100°C, storage elasticity in dynamic viscoelasticity measurement The rate G' has an inflection point in the angular frequency range below 10E+02 rad / s, and the storage modulus G' at the angular frequency below the inflection point is 10E+05Pa or more and 10E+06Pa or less. Thereby, void-free mounting and good solder jointability can be realized.

Description

technical field [0001] The present invention relates to an underfill material used for mounting a semiconductor chip and a method of manufacturing a semiconductor device using the underfill material. This application claims priority on the basis of Japanese Patent Application No. Japanese Patent Application No. 2013-187980 for which it applied in Japan on September 11, 2013, By referring this application, this application is used here. Background technique [0002] In recent years, in the semiconductor chip mounting method, for the purpose of shortening the process, "pre-applied underfill film (PUF: Pre-applied Underfill Film)" in which an underfill film is pasted on the electrode of a semiconductor IC (Integrated Circuit, integrated circuit) has been studied. )"usage of. [0003] The mounting method using this pre-feed type underfill film is performed, for example, as follows (for example, refer to Patent Document 1). [0004] Step A: The underfill film is pasted on the w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/29H01L25/065H01L21/78H01L21/56H01L21/683H01L21/60C09J7/40C09J11/06C09J133/16C09J163/02
CPCH01L21/6836H01L2221/68327H01L2221/68377H01L2224/73104H01L2224/83191H01L2224/271H01L23/293H01L21/563H01L24/13H01L24/16H01L24/27H01L24/29H01L24/32H01L24/73H01L24/81H01L24/83H01L24/92H01L24/94H01L25/0657H01L25/50H01L2224/13025H01L2224/13111H01L2224/13147H01L2224/16146H01L2224/16227H01L2224/16238H01L2224/2919H01L2224/29191H01L2224/2929H01L2224/29291H01L2224/29387H01L2224/32145H01L2224/32225H01L2224/81191H01L2224/81204H01L2224/81815H01L2224/83204H01L2224/83862H01L2224/92H01L2224/9211H01L2224/9212H01L2224/94H01L2225/06517H01L2224/27003H01L2225/06513C09D133/066C08G59/4215C08L63/00H01L2924/01082H01L2924/01083H01L2924/01047H01L2924/01029H01L2924/01051H01L2924/00014H01L2924/00012H01L2924/0665H01L2924/0635H01L2924/05442H01L2924/05341H01L2924/0549H01L2924/0532H01L2924/0102H01L2924/0544H01L2924/01006H01L2924/01012H01L2224/27H01L2224/81H01L2224/83H01L2224/11H01L21/78C08L33/16C09J7/00C09J133/20C09J163/00C09J2203/326C09J2301/312H01L2224/81193H01L2224/81203H01L2924/186
Inventor 小山太一
Owner DEXERIALS CORP
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