Copper alloy target for solder bonding electrode and coating film formation of solder bonding electrode

A technology for bonding electrodes and copper alloy targets, applied in welding equipment, circuits, sputtering plating, etc., can solve the problems of high intensity and high price of precious metals, and achieve the effect of reducing the cost of film formation and good solder bonding.

Active Publication Date: 2022-01-14
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, due to the high price of precious metals such as silver, there is a strong demand in the market to form a coating by sputtering using an alloy target mainly composed of a metal that is cheaper than silver.

Method used

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  • Copper alloy target for solder bonding electrode and coating film formation of solder bonding electrode
  • Copper alloy target for solder bonding electrode and coating film formation of solder bonding electrode

Examples

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Effect test

Embodiment

[0048] Hereinafter, although an Example and a comparative example demonstrate this invention in detail, this invention is not limited to the following Example.

[0049] "Examples and Comparative Examples"

[0050]

[0051] In each of the Examples and Comparative Examples, samples of copper alloy targets whose metal materials other than copper contained ratios shown in Table 1 below were produced. Among them, samples 8, 9, and 10 of the comparative example have component compositions similar to samples 9, 1, and 5 of examples of the copper alloy target for film formation of solder joint electrodes described in Patent Document 2.

[0052] More specifically, using a high-frequency melting furnace, vacuumize the chamber to below 0.009Pa, and then introduce argon gas up to 500Pa. In this chamber, the contents are adjusted so that the metal materials other than copper are listed in the following table 1 A metal material composed of copper, silver, nickel and palladium having the ...

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Abstract

Provided are a solder bonding electrode having a copper alloy coating having excellent solder wettability, and a copper alloy target for forming a coating of a solder bonding electrode capable of forming the copper alloy coating. Compared with the sputtering film formation of the alloy target mainly composed of silver, the film formation cost can be reduced, and it shows good solder bondability even for the joint part whose size and shape have been miniaturized in recent years. Has a copper alloy coating formed of an alloy of copper, silver, nickel, and palladium, containing copper as a main component, containing silver in a ratio of more than 10% by mass to less than 50% by mass, and more than 0.05% by mass to less than 1.0% by mass % contains nickel, and contains palladium in a ratio of more than 0.1% by mass and less than 1.0% by mass.

Description

technical field [0001] The present invention relates to an electrode such as an external electrode to be joined when soldering electronic components, semiconductor elements, etc. The target, more specifically, relates to a solder bonding electrode in which a copper alloy film suitable for solder bonding is formed on the outermost layer of an electronic component, an external electrode of a semiconductor element, etc., and a device for forming the copper alloy film Copper alloy target for film formation of solder bonding electrodes. Background technique [0002] In general, when soldering electronic components, semiconductor elements, etc., a film is formed on the surface of an electrode such as an external electrode to be bonded to achieve a state of high wettability with solder for bonding. . [0003] For example, when the base alloy constituting the skeleton of the joined part is Fe-42 mass% Ni alloy (alloy 42), the surface of the joined part is plated with gold, or Cu-2...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C23C14/34
CPCC22C9/00C23C14/3407C23C14/14C23C14/3414C22C9/06C22C1/08H05K1/09H01L23/488B23K1/20
Inventor 渡边宏幸山岸浩一大井川钦哉桑原正和仁藤茂生
Owner SUMITOMO METAL MINING CO LTD
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