Solder joint electrode and copper alloy target for forming coating film of solder joint electrode

A technology for joining electrodes and copper alloy targets, which is applied in the direction of welding equipment, circuits, electrical components, etc., can solve the problems of strong force and high price of precious metals, and achieve the effect of reducing the cost of film formation and good solder jointability

Active Publication Date: 2019-10-11
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, due to the high price of precious metals such as silver, there is a strong demand in the market to form a coating by sputtering using an alloy target mainly composed of a metal that is cheaper than silver.

Method used

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  • Solder joint electrode and copper alloy target for forming coating film of solder joint electrode
  • Solder joint electrode and copper alloy target for forming coating film of solder joint electrode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0048] Hereinafter, although an Example and a comparative example demonstrate this invention in detail, this invention is not limited to the following Example.

[0049] "Examples and Comparative Examples"

[0050]

[0051] In each of the Examples and Comparative Examples, samples of copper alloy targets whose metal materials other than copper contained ratios shown in Table 1 below were produced. Among them, samples 8, 9, and 10 of the comparative example have component compositions similar to samples 9, 1, and 5 of examples of the copper alloy target for film formation of solder joint electrodes described in Patent Document 2.

[0052] More specifically, using a high-frequency melting furnace, vacuumize the chamber to below 0.009Pa, and then introduce argon gas up to 500Pa. In this chamber, the contents are adjusted so that the metal materials other than copper are listed in the following table 1 A metal material composed of copper, silver, nickel and palladium having the ...

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PUM

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Abstract

The invention provides a solder joint electrode including a copper alloy film having excellent solder wettability, and a solder joint electrode capable of forming the copper alloy film. In the copperalloy target for forming a film, the solder joint electrode can reduce the film formation cost as compared with the sputtering film formation using an alloy target containing silver as a main component, and the size and shape have been refined in recent years. The joint also shows good solder jointability. The solder joint electrode comprises a copper alloy film formed of an alloy of copper, silver, nickel and palladium, with copper as a main component and a mass of more than 10 % and less than 50% by mass contain silver, contain nickel in a ratio of more than 0.05% by mass and less than 1.0%by mass, and palladium in a ratio of more than 0.1% by mass and less than 1.0% by mass.

Description

technical field [0001] The present invention relates to an electrode such as an external electrode to be joined when soldering electronic components, semiconductor elements, etc. The target, more specifically, relates to a solder bonding electrode in which a copper alloy film suitable for solder bonding is formed on the outermost layer of an electronic component, an external electrode of a semiconductor element, etc., and a device for forming the copper alloy film Copper alloy target for film formation of solder bonding electrodes. Background technique [0002] In general, when soldering electronic components, semiconductor elements, etc., a film is formed on the surface of an electrode such as an external electrode to be bonded to achieve a state of high wettability with solder for bonding. . [0003] For example, when the base alloy constituting the skeleton of the joined part is Fe-42 mass% Ni alloy (alloy 42), the surface of the joined part is plated with gold, or Cu-2...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C23C14/34
CPCC22C9/00C23C14/3407C23C14/14C23C14/3414C22C9/06C22C1/08H05K1/09H01L23/488B23K1/20
Inventor 渡边宏幸山岸浩一大井川钦哉桑原正和仁藤茂生
Owner SUMITOMO METAL MINING CO LTD
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