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MEMS microphone and environmental sensor integrated structure and integrated manufacturing method

A technology of environmental sensors and manufacturing methods, applied in the field of sensors, can solve the problems of large occupied area and not meeting the development requirements, and achieve the effects of improving efficiency, meeting the development of light and thin, and reducing size

Active Publication Date: 2016-02-03
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of capacitor structure arranged in parallel occupies a large area and does not meet the requirements of modern development.

Method used

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  • MEMS microphone and environmental sensor integrated structure and integrated manufacturing method
  • MEMS microphone and environmental sensor integrated structure and integrated manufacturing method
  • MEMS microphone and environmental sensor integrated structure and integrated manufacturing method

Examples

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Embodiment Construction

[0032] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0033] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0034] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0035] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses an MEMS microphone and environmental sensor integrated structure and integrated manufacturing method. A base material is provided with a diaphragm and a back electrode forming a capacitor structure; the upper end of the base material is provided with at least one groove. In addition, a sensitive electrode is provided above the base material, and comprises a fixing part fixed to the end surface of the base material through a first sacrificial layer, and a bending part extending into the groove, wherein the bending part and the sidewall of the groove form a capacitor structure. The integrated structure integrates the capacitor structure of a microphone with the capacitor structure of an environmental sensor on the base material, thereby improving the integration level of the microphone and the environmental sensor, and substantially reducing the size of a whole packaging structure; meanwhile, the diaphragm of the microphone, and the sensitive electrode of the environmental sensor can employ same materials and manufacturing processes, thereby simultaneously manufacturing an MEMS microphone and an environmental sensor based on a same base material, and improving manufacturing efficiency.

Description

technical field [0001] The present invention relates to the field of sensors, and more specifically, relates to an integrated structure of a MEMS microphone and an environmental sensor; the present invention also relates to a manufacturing method for integrating the MEMS microphone and the environmental sensor. Background technique [0002] In recent years, with the development of science and technology, the volume of electronic products such as mobile phones and notebook computers has been continuously reduced, and people have higher and higher performance requirements for these portable electronic products, which requires the supporting electronic components The volume must also be reduced accordingly. [0003] As a measuring device, sensors have been widely used in electronic products such as mobile phones and notebook computers. In the existing process structure, due to the different detection principles, the MEMS microphone and the MEMS environmental sensor chip are ge...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R31/00
CPCH04R19/04B81B7/0029B81B7/02B81B2201/0257B81B2201/0292B81C1/00158H04R19/005H04R31/00H04R2201/003
Inventor 詹竣凯蔡孟锦邱冠勋周宗燐宋青林
Owner GOERTEK MICROELECTRONICS CO LTD
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