Finfet thermal protection methods and related structures
A substrate and drain region technology, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as weakening device performance, adverse effects of high-mobility materials, and degradation of high-mobility materials
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[0030] The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the invention. Of course, these are only examples and are not intended to limit the invention. For example, in the following description, forming the first member above or on the second member may include an embodiment in which the first member and the second member are formed in direct contact, and may also be included between the first member and the second member. An additional component may be formed between, so that the first component and the second component may not directly contact an embodiment. In addition, the present invention may repeat reference numerals and / or letters in each example. This repetition is for the purpose of simplicity and clarity, and does not in itself illustrate the relationship between the various embodiments and / or co...
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