FBAR (Film Bulk Acoustic Resonator) based harmonic resonance amplifier
A thin-film bulk acoustic wave and resonator technology, applied in the fields of microelectronics, communications, and semiconductors, can solve the problems of limiting efficiency improvement, reducing the reflection coefficient of high-order harmonics, and difficult to achieve total reflection, and reducing harmonic path loss. , the effect of suppressing the generation of harmonic power and improving the efficiency of the amplifier
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Embodiment 1
[0054] Figure 2A and Figure 2B They are respectively a plan view and a cross-sectional view of a harmonically tuned amplifier based on a thin film bulk acoustic resonator provided in Embodiment 1 of the present invention. like Figure 2A and Figure 2B shown, the amplifier consists of:
[0055] The packaging package 11 includes a package base 111 , a package input terminal 112 and a package output terminal 113 . The shell input end 112 is a signal input end, and the shell output end 113 is a signal output end.
[0056] The amplification module 12 is disposed on the base 111 , and the amplification module 12 includes an input terminal 122 , an output terminal 123 and a ground terminal 121 .
[0057] The amplifying module may be a transistor, or an amplifying circuit including a transistor. For the convenience of description, the present invention is described by taking the amplifying module as a transistor as an example.
Embodiment 2
[0078] Figure 10 It is a cross-sectional view of a harmonically tuned amplifier based on a thin-film bulk acoustic resonator provided in Embodiment 2 of the present invention. Different from the amplifier provided in Embodiment 1 of the present invention, this amplifier does not need to be packaged, and the base is directly embedded on the heat sink. The gate of the transistor is electrically connected to the input matching network, and the drain of the transistor is electrically connected to the output matching network. connect. Such as Figure 10 As shown, the amplifier includes a transistor 12, a first film bulk acoustic resonator group 1301, a second film bulk acoustic resonator group 1302, a base 11, a heat sink 16, an internal matching capacitor 14, a bonding wire 15 and a PCB (printed wiring board, PrintedCircuitBoard). The PCB includes a medium 21 , an input matching network 22 and an output matching network 23 . The thin film bulk acoustic resonator in this embod...
Embodiment 3
[0082] The harmonic tuning amplifier based on the film bulk acoustic resonator provided in the third embodiment of the present invention can be improved based on the first or second embodiment. For the convenience of description, the improvement of the first embodiment is taken as an example for illustration. Figure 11 It is a cross-sectional view of a harmonically tuned amplifier based on a thin film bulk acoustic resonator provided in Embodiment 3 of the present invention. Such as Figure 11 As shown, there are two sets of thin-film bulk acoustic resonators at the output end of the transistor in the package package of the amplifier. Different from the harmonically tuned amplifier based on thin film bulk acoustic resonators provided in Embodiment 1 of the present invention, the drain of the transistor of the amplifier is not only electrically connected to the first bonding end of the first group of thin film bulk acoustic resonators through the bonding wire. connection, an...
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Abstract
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