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FBAR (Film Bulk Acoustic Resonator) based harmonic resonance amplifier

A thin-film bulk acoustic wave and resonator technology, applied in the fields of microelectronics, communications, and semiconductors, can solve the problems of limiting efficiency improvement, reducing the reflection coefficient of high-order harmonics, and difficult to achieve total reflection, and reducing harmonic path loss. , the effect of suppressing the generation of harmonic power and improving the efficiency of the amplifier

Active Publication Date: 2016-02-10
DYNAX SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] 1. The increase of harmonic loss restricts the improvement of efficiency
The total harmonic reflection end face is too far away from the core component transistor of the amplifier or the amplifying circuit including the transistor, and the path is too long, resulting in an increase in harmonic loss and a decrease in the high-order harmonic reflection coefficient, making it difficult to achieve true total reflection and partial harmonic reflection. The wave power is lost in the path between the transistor or the amplifier circuit including the transistor and the open circuit or short circuit end face
Amplifiers that are harmonically tuned on the circuit board outside the amplifier package limit efficiency gains
[0009] 2. The harmonic path is too long, the dispersion increases, and the bandwidth of harmonic tuning is limited
It is difficult for the lumped resonator composed of stubs or capacitors and inductors to reflect all the high-order harmonic energy corresponding to the entire operating bandwidth to the transistor or the amplifier circuit including the transistor
[0010] 3. The mutual influence between the fundamental wave matching network and the harmonic tuning network makes the design of the power amplifier circuit more difficult
Harmonic tuning on the circuit board outside the package of the amplifier needs to consider the mutual interference between the harmonic tuning network and the fundamental matching network. Often there is a phenomenon of taking care of one and losing the other, and it is difficult to maximize the performance of the amplifier.

Method used

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  • FBAR (Film Bulk Acoustic Resonator) based harmonic resonance amplifier
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  • FBAR (Film Bulk Acoustic Resonator) based harmonic resonance amplifier

Examples

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Effect test

Embodiment 1

[0054] Figure 2A and Figure 2B They are respectively a plan view and a cross-sectional view of a harmonically tuned amplifier based on a thin film bulk acoustic resonator provided in Embodiment 1 of the present invention. like Figure 2A and Figure 2B shown, the amplifier consists of:

[0055] The packaging package 11 includes a package base 111 , a package input terminal 112 and a package output terminal 113 . The shell input end 112 is a signal input end, and the shell output end 113 is a signal output end.

[0056] The amplification module 12 is disposed on the base 111 , and the amplification module 12 includes an input terminal 122 , an output terminal 123 and a ground terminal 121 .

[0057] The amplifying module may be a transistor, or an amplifying circuit including a transistor. For the convenience of description, the present invention is described by taking the amplifying module as a transistor as an example.

[0058] The transistors may be gallium nitride ...

Embodiment 2

[0078] Figure 10 It is a cross-sectional view of a harmonically tuned amplifier based on a thin-film bulk acoustic resonator provided in Embodiment 2 of the present invention. Different from the amplifier provided in Embodiment 1 of the present invention, this amplifier does not need to be packaged, and the base is directly embedded on the heat sink. The gate of the transistor is electrically connected to the input matching network, and the drain of the transistor is electrically connected to the output matching network. connect. Such as Figure 10 As shown, the amplifier includes a transistor 12, a first film bulk acoustic resonator group 1301, a second film bulk acoustic resonator group 1302, a base 11, a heat sink 16, an internal matching capacitor 14, a bonding wire 15 and a PCB (printed wiring board, PrintedCircuitBoard). The PCB includes a medium 21 , an input matching network 22 and an output matching network 23 . The thin film bulk acoustic resonator in this embod...

Embodiment 3

[0082] The harmonic tuning amplifier based on the film bulk acoustic resonator provided in the third embodiment of the present invention can be improved based on the first or second embodiment. For the convenience of description, the improvement of the first embodiment is taken as an example for illustration. Figure 11 It is a cross-sectional view of a harmonically tuned amplifier based on a thin film bulk acoustic resonator provided in Embodiment 3 of the present invention. Such as Figure 11 As shown, there are two sets of thin-film bulk acoustic resonators at the output end of the transistor in the package package of the amplifier. Different from the harmonically tuned amplifier based on thin film bulk acoustic resonators provided in Embodiment 1 of the present invention, the drain of the transistor of the amplifier is not only electrically connected to the first bonding end of the first group of thin film bulk acoustic resonators through the bonding wire. connection, an...

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Abstract

The invention discloses an FBAR (Film Bulk Acoustic Resonator) based harmonic resonance amplifier. The FBAR based harmonic resonance amplifier comprises a base, an amplification module, a signal input end, a signal output end and at least a group of FBARs. The amplification module comprises an input end, an output end and a grounding end; at least a group of the FBARs used for harmonic short-circuiting is arranged respectively between the input end of the amplification module and the signal input end and / or between the output end of the amplification module and the signal output end. One group of the FBARs comprises at least a FBAR structure; and one FBAR structure comprises a first electrode, a second electrode and a dielectric film layer arranged between the first electrode and the second electrode. According to the FBAR based harmonic resonance amplifier provided by the embodiment, the amplifier efficiency is increased as the amplification module of the amplifier is subjected to harmonic tuning through each FBAR.

Description

technical field [0001] The invention relates to the technical fields of semiconductor, microelectronics and communication, in particular to a harmonic tuning amplifier based on a film bulk acoustic wave resonator. Background technique [0002] With the development of communication technology, communication systems are gradually developing in the direction of high efficiency, high frequency, high power, broadband and miniaturization. As the core component of the communication system, the efficiency of the amplifier directly affects the efficiency of the communication system. [0003] The drain efficiency equation for an amplifier is as follows: [0004] DE = P Out , f P DC = P Out , f ...

Claims

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Application Information

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IPC IPC(8): H03F1/02
Inventor 杨天应张乃千
Owner DYNAX SEMICON