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One-component flexible epoxy adhesive and preparation method thereof

An epoxy adhesive, one-component technology, applied in the direction of epoxy resin glue, adhesives, adhesive additives, etc., can solve the problems of high brittleness of epoxy adhesive, high price, high viscosity of toughening resin, etc., to achieve Low cost, stable product performance, and good flexibility

Active Publication Date: 2016-02-17
YANTAI SEAYU NEW MATERIALS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It mainly solves the problems of high brittleness of existing epoxy adhesives, high viscosity of toughening resins and high price

Method used

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  • One-component flexible epoxy adhesive and preparation method thereof
  • One-component flexible epoxy adhesive and preparation method thereof
  • One-component flexible epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1: Prepare a one-component flexible epoxy curing agent according to the following table and the following steps.

[0025] (1) Mix 40 parts of self-made modified epoxy resin and 0.4 parts of stabilizer, stir for 1 hour, and control the temperature at 15-30°C

[0026] (2) Add 30 parts of mercapto compound, stir for 1 hour, and control the temperature at 15-30°C

[0027] (3) Add filler and viscosity regulator, stir for 30 minutes respectively, and control the temperature at 15-30°C

[0028] (4) Add stabilizer, continue to stir for 0.5 hours until the mixture is uniform, and control the temperature at 15-30°C

[0029] (5) Add 8 parts of accelerator while stirring, continue to stir for 0.5 hours until the mixture is uniform, and control the temperature at 15-30°C;

[0030]

Embodiment 2

[0031] Embodiment 2: Prepare a one-component flexible epoxy adhesive according to the ratio in the table below and the steps in Embodiment 1.

[0032]

Embodiment 3

[0033] Embodiment 3: Prepare a one-component flexible epoxy adhesive according to the ratio in the table below and the steps in Embodiment 1.

[0034]

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PUM

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Abstract

The invention relates to a one-component flexible electronic adhesive and a preparation method thereof. The adhesive is characterized by being prepared from raw materials in parts by weight as follows: 20-50 parts of liquid-state self-made modified epoxy resin, 15-40 parts of a curing agent, 20-40 parts of filler, 0-3 parts of a viscosity regulator, 0.2-1 part of a stabilizer and 2-15 parts of an accelerator, wherein the curing agent adopts a sulfhydryl compound; the accelerator adopts an amine accelerator, an amine derivative accelerator or an imidazole accelerator; the liquid-state self-made modified epoxy resin adopts one or a mixture of bisphenol A epoxy resin, bisphenol F epoxy resin and phenol-formaldehyde resin and is prepared through the following steps: liquid-state epoxy resin and the curing agent are mixed and stirred in the ratio being 85:15, the temperature is controlled to be 75-80 DEG C, the accelerator is added during stirring, stirring is continued for 2 h after complete impregnation, and the temperature is controlled to be 75-80 DEG C; a product is cooled to 15-30 DEG C for standby application. A synthetic reaction process is simple and easy to operate, the cost is low, and the product has stable performance and wide application.

Description

technical field [0001] The invention relates to a self-modified epoxy resin, in particular to a single-component flexible electronic adhesive and a preparation method thereof. Background technique [0002] Nowadays, the requirements for epoxy resin in the market are getting higher and higher. Unmodified resin cured products are brittle, not resistant to impact and vibration, and easy to crack, so various toughening of epoxy resin and curing agent occurs. Such as rubber elastomer toughening, thermoplastic resin toughening, and core-shell microcapsule toughening, these types of toughening agents have relatively high viscosity and are expensive. Toughening with soft segment curatives typically results in loss of heat resistance. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies of the above-mentioned prior art and provide a kind of one-component flexible epoxy adhesive. The method mainly solves the problems of high britt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06
Inventor 李娜李峰贺国新
Owner YANTAI SEAYU NEW MATERIALS CORP LTD
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