A Method for Etching Grating Grooves by Rotating the Etching Angle

Abstract

The invention discloses a method of etching a grating groove by rotating an etching angle. The method comprises steps: design grating groove parameters such as a groove width, a groove depth and a groove shape are loaded; ion beam etching machine parameters such as an etching speed and an etching ratio are initialized; grating parameters such as a grating line density, an initial grating phtoresist thickness and a grating duty ratio are initialized; a preset groove is cut, and the number of etching angles is determined; an etching angle is determined; the etching time is determined; the etching parameters are optimized, and whether normalized root mean square deviation of the etching result achieves a preset requirement is judged; if the preset requirements is not achieved, the number of etching angles is increased until the normalized root mean square deviation of the etching result meets an actual requirement; and if the preset requirements is achieved, processing is carried out according to calculation parameters. By adopting the method of the invention, the optimal processing parameters for the design groove can be acquired quickly.

Description

technical field [0001] The invention relates to the field of grating groove type etching, in particular to a control method of a grating groove type under ion beam etching. Background technique [0002] Gratings with special grooves have a wide range of uses. Special groove gratings include sinusoidal gratings, blazed gratings, etc. The traditional methods of making special grating grooves include fixed-angle ion beam etching, mechanical scribing and wet etching along the crystallographic direction of Si. [0003] Among the traditional dry etching methods, ion beam etching is the most widely used due to its advantages of good etching uniformity, high etching efficiency, and suitability for large-area processing. For special groove structures with special requirements for diffraction efficiency, such as sinusoidal grooves, arc grooves and triangular grooves, the existing processing methods are not very suitable. [0004] The present invention provides a method for etching ...

AI Technical Summary

Problems solved by technology

For special groove structures with special requirements on diffraction efficiency, such as sinusoidal grooves, arc grooves and triangular grooves, the existing processing methods are not suitable

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