OLED display device and packaging technology thereof

A technology of display device and packaging process, which is applied in the field of OLED display device and its packaging process, can solve the problems of not achieving marginalization of the position, increasing the display area, and slow packaging speed, so as to achieve the maximum, realize the display area, improve the The effect of package speed

Inactive Publication Date: 2016-02-17
北京维信诺光电技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem in this method is that its position is not marginalized, and the display area cannot be maximized. Secondly, because its groove is set inside, it can only be heated by radiation sources (laser, infrared), and Corresponding to the heating method using a radiation source, there is a problem of slow packaging speed, which is only 0.2 mm / s to 5 mm / s

Method used

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  • OLED display device and packaging technology thereof
  • OLED display device and packaging technology thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1 provides a packaging process for OLED display devices, such as figure 1 shown, including the following steps:

[0028] Step 1: Cut the packaging glass cover plate and substrate to form multiple independent glass cover plate units and substrate units, and preheat the low-temperature glass frit to molten glass for use;

[0029] Step 2: Place the packaging glass cover on the substrate, the size of the packaging glass cover is smaller than the size of the substrate, and the distance between the outer edge of the substrate and the outer edge of the packaging glass cover is 0.5mm-2.0mm, optional 0.5-1.5 mm, more preferably 1 mm, and a circle of exposed peripheral parts of the substrate can be formed on the outer edge of the substrate.

[0030] Step 3: Coat the molten low-temperature glass water on the peripheral part of the exposed substrate with a robot or other equipment that can be used for coating work. There is a length difference between the package cover ...

Embodiment 2

[0031] Embodiment 2 provides a packaging process for OLED display devices, such as figure 2 shown, including the following steps:

[0032] Step 1: Cut the packaging glass cover plate and substrate to form multiple independent glass cover plate units and substrate units, and preheat the low-temperature glass frit to molten glass water for use. The melting temperature of the low-temperature glass frit is lower than that of the glass substrate, generally 320°C-600°C.

[0033] Step 2: Prefabricate a notch on the outer edge of the sealing glass cover plate. The notch is designed around the outer edge of the sealing glass cover plate. The shape of the notch can be arc-shaped or square. The notch is along the vertical direction and the The depth in the horizontal direction is 0.5mm-2mm, preferably 0.5mm-1.5mm. The vertical depth of the notch is less than or equal to the thickness of the package cover. The thickness of the packaging cover plate is 1.0mm-2.0mm.

[0034] Step 3: pl...

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PUM

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Abstract

The invention discloses an OLED display device and a packaging technology thereof. The technology concretely comprises the steps that a packaging glass cover plate and a substrate are cut, and glass material is heated to the molten state of glass water for standby application; the packaging glass cover plate is arranged on the substrate; and glass water is coated on the end surface, which is contacted with the substrate, of the packaging glass cover plate and then naturally cooled to room temperature so that the preparation process is completed. The size of the packaging glass cover plate is less than that of the substrate so that a circle of bare peripheral part of the substrate is formed outside the external edge of the packaging glass cover plate, and glass water is coated on the bare peripheral part of the substrate. According to the packaging technology of the OLED display device, packaging glass is processed in advance so that maximization of a display region can be realized and packaging speed can also be enhanced.

Description

technical field [0001] The invention relates to an OLED display device and a packaging process thereof. Background technique [0002] The size of the display area of ​​an OLED display device is an important indicator of an OLED display device, and the industry is seeking a solution to maximize the display area. The packaging method of the display device is an important factor affecting the size of the display area. Currently, there are two commonly used packaging methods for display devices: [0003] Method 1: Use epoxy resin to form a seal after being cured by ultraviolet light. This approach cannot maximize the display area, and in many cases cannot prevent oxygen and moisture from diffusing into the OLED device. [0004] Method 2: Melt the low-temperature frit to form a seal through a radiation source (laser, infrared). The low-temperature glass frit has good thermal expansion matching and good adhesion with the substrate glass material of the OLED device. After melti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L27/32
CPCH10K59/12H10K71/00
Inventor 倪文翠
Owner 北京维信诺光电技术有限公司
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