Clamp and method for single surface electroplating of substrates

Abstract

The invention provides a clamp for single surface electroplating of substrates. The clamp comprises a supporting plate, two probe electrodes and electrode leads connected with the probe electrodes. The supporting plate is provided with a groove matched with the substrates. One ends of the probe electrodes are fixed to the supporting plate through studs, and probes of the probe electrodes are placed into accommodation holes in the supporting plate. In electroplating, the substrates are placed into the groove, and the probes of the probe electrodes rotate to the substrates. According to the clamp, the back surfaces of the substrates are stably attached to the groove of the supporting plate through the tension of water, the probe electrodes have the electrode electroplating effect and can press the substrates, and therefore the back surfaces of the substrates can be completely isolated from electroplating liquid, and single surface electroplating of the substrates can be successfully realized. The clamp has the advantages of being simple in structure, easy and convenient to use, free of pollution, low in cost and high in efficiency.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and relates to a substrate electroplating device and a method, in particular to a fixture and a method for electroplating one side of a substrate. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation ( Such as rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) The current electroplating process is to place the objects to be electroplated directly in the electroplating tank filled with the electroplating solution, and then perform electroplating. However, in the actual production process, many products are removed from the aspects of their specific functions ...

AI Technical Summary

Problems solved by technology

Some use mucous membrane protection to achieve single-sided electroplating. Although the process is relatively simple, stick the mucous membrane on the back of the circuit board and remove the mucous membrane after electroplating is completed; The binder is not easy to remove, and the remaining binder will cause hidden dangers to the subsequent sintering process

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