265results about How to "Appropriate thickness" patented technology

The invention relates to a substantially homogenous liquid composition capable of percutaneous delivery of one or more physiologically active agents, the composition including a rate modulating polymer, a volatile solvent and at least one physiologically active agent, said rate modulating polymer being selected to enable modulation of the rate of delivery of said physiologically active agent. Methods of percutaneous delivery of active agents and of prophylactic or therapeutic antimicrobial, antifungal or antiviral treatment using the compositions of the invention are also described.

A porous polymer sheet or membrane is provided with a thin coating of an electrically non-conductive ceramic composition and the coating conforms to all surfaces, including the pore surfaces, of the membrane. Such a coated membrane serves well, for example, as an intra-cell separator in a lithium ion battery. The coating increases the mechanical properties and thermal stability of the separator in battery operation and retains electrolyte. The coating may be formed by a two-step vapor-phase process in which atoms of one or more metals such as aluminum, calcium, magnesium, titanium, silicon and/or zirconium are deposited in a conformal layer on a workpiece surface. The metal atoms may then be reacted with ammonia, carbon dioxide, and or water to form their respective non-conductive nitrides, carbides, and/or oxides on the surface. The two-step process is repeated as necessary to obtain a ceramic material coating of desired thickness.

Provided herein are devices, systems, and methods of employing the same for the performance of bioinformatics analysis. The apparatuses and methods of the disclosure are directed in part to large scale graphene FET sensors, arrays, and integrated circuits employing the same for analyte measurements. The present GFET sensors, arrays, and integrated circuits may be fabricated using conventional CMOS processing techniques based on improved GFET pixel and array designs that increase measurement sensitivity and accuracy, and at the same time facilitate significantly small pixel sizes and dense GFET sensor based arrays. Improved fabrication techniques employing graphene as a reaction layer provide for rapid data acquisition from small sensors to large and dense arrays of sensors. Such arrays may be employed to detect a presence and/or concentration changes of various analyte types in a wide variety of chemical and/or biological processes, including DNA hybridization and/or sequencing reactions. Accordingly, GFET arrays facilitate DNA sequencing techniques based on monitoring changes in hydrogen ion concentration (pH), changes in other analyte concentration, and/or binding events associated with chemical processes relating to DNA synthesis within a gated reaction chamber of the GFET based sensor.

The plating method comprises the step of forming a resin layer 10 over a substrate 16; the step of cutting the surface part of the resin layer 10 with a cutting tool 12; the step of forming a seed layer 36 on the resin layer 10 by electroless plating; and the step of forming a plating film 44 on the seed layer 36 by electroplating. Suitable roughness can be give to the surface of the resin layer 10, whereby the adhesion between the seed layer 36 and the resin layer 10 can be sufficiently ensured. Excessively deep pores are not formed in the surface of the resin layer 10, as are by desmearing treatment, whereby a micronized pattern of a photoresist film 40 can be formed on the resin layer 10. Thus, interconnections 44, etc. can be formed over the resin layer 10 at a narrow pitch with high reliability ensured.

An object of the present invention is to provide a cell construct for cell transplantation capable of having a thickness suitable for cell transplantation, preventing the necrosis of transplanted cells, and forming blood vessels in the transplantation site after transplantation. The present invention provides a cell construct for cell transplantation which comprises polymer blocks having biocompatibility and cells of at least one type, wherein the plural polymer blocks are arranged in spaces between the plural cells.

An interbody spinal implant including a body having a top surface, a bottom surface, opposing lateral sides, opposing anterior and posterior portions, a substantially hollow center, and single vertical aperture, as well as an integration plate having a roughened surface topography on its top surface. The integration plate and implant body are joined together with a durable connection.

Method for planning dental treatment which includes collecting data and images of the initial situation, creating an initial 3D model, studying the initial situation, analyzing the smile and planning in a center, all by means of software, creating and producing an envisaged final 3D model, creating a negative of the envisaged final model, creating in-situ a provisional prosthesis (mock-up) on the teeth of the patient which represents the final result which would be left after the treatment, reviewing the result and collecting photographs and video of the envisaged result and producing the required prosthesis, implant or brace elements from the digital data.

An interbody spinal implant including a body having a top surface, a bottom surface, opposing lateral sides, opposing anterior and posterior portions, a substantially hollow center, and single vertical aperture, as well as an integration plate having a roughened surface topography on its top surface. The integration plate and implant body are joined together durable, complementary tongue and groove connections.

An interbody spinal implant including a body having a top surface, a bottom surface, opposing lateral sides, opposing anterior and posterior portions, a substantially hollow center, and single vertical aperture, as well as an integration plate having a roughened surface topography on its top surface. The integration plate and implant body are joined together with a durable connection.

The present invention provides an exhaust gas purifying catalyst and a process for producing a metal oxide particle comprising multiple species of metal oxides and capable of satisfactorily exerting the properties of respective metal oxides. A process of the present invention comprises providing a sol containing at least a population of first colloid particles and a population of second colloid particles differing in the isoelectric point with each other; adjusting the pH of the sol to be closer to the isoelectric point of the population of first colloid particles than to the isoelectric point of the population of second colloid particles, thereby aggregating the population of first colloid particles; adjusting the pH of the sol, thereby aggregating the population of second colloid particles onto the population of first colloid particles aggregated; and drying and firing the obtained aggregate.

A semiconductor device includes a base plate having one main surface joined to an insulating substrate on which a semiconductor chip and the like are mounted and a transfer mold resin which is so provided as to cover the one main surface of the base plate, the insulating substrate, the semiconductor chip, and the like and expose the other main surface of the base plate. The coefficient of linear expansion of the base plate is lower than that of copper and the coefficient of linear expansion of the transfer mold resin is not higher than 16 ppm/° C. The transfer mold resin has such scooped shapes as to expose opposed short-side centers and the vicinity of the base plate, respectively. The base plate has mounting holes in portions exposed by the scooped shapes of the transfer mold resin.

The plating method comprises the step of forming a resin layer 10 over a substrate 16; the step of cutting the surface part of the resin layer 10 so that the ten-point height of irregularities of the surface of the resin layer 10 is 0.5-5 μm; the step of forming a seed layer 36 on the resin layer 10; and the step of forming a plating film 44 on the seed layer 36 by electroplating. Suitable roughness can be give to the surface of the resin layer 10, whereby the adhesion between the seed layer 36 and the resin layer 10 can be sufficiently ensured. Excessively deep pores are not formed in the surface of the resin layer 10, as are by desmearing treatment, whereby a micronized pattern of a photoresist film 40 can be formed on the resin layer 10. Thus, interconnections 44, etc. can be formed over the resin layer 10 at a narrow pitch with high reliability ensured.