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Piezoelectric driving single-arm type high-speed lead wire clamp

A technology of piezoelectric drive and lead wires, which is applied in the direction of circuits, electrical components, and electric solid devices, can solve the problems of difficult and stable clamping force, complicated force calibration process, etc., to achieve measurement and real-time feedback, reduce Overall mass and moment of inertia, effect of small size

Active Publication Date: 2016-02-24
TIANJIN UNIV
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

These methods will be affected by inertial force during the movement process, it is difficult to accurately ensure the stability and controllability of the clamping force, and the force calibration process is more complicated

Method used

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  • Piezoelectric driving single-arm type high-speed lead wire clamp
  • Piezoelectric driving single-arm type high-speed lead wire clamp
  • Piezoelectric driving single-arm type high-speed lead wire clamp

Examples

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Embodiment Construction

[0015] In order to further understand the invention content, characteristics and effects of the present invention, the following examples are given, and detailed descriptions are as follows in conjunction with the accompanying drawings:

[0016] see Figure 1 to Figure 4 , a piezoelectric-driven single-arm high-speed lead clamp, the clamp is integrally formed by wire-cutting a plate, including an L-shaped base 1, and a parallelogram mechanism 2 and a Bridge-type displacement amplifying mechanism 4; described bridge-type displacement amplifying mechanism 4 is positioned between described parallelogram mechanism 2 and L-shaped substrate 1, and described bridge-shaped displacement amplifying mechanism 4 is provided with and parallel with described L-shaped substrate 1 lower end The swing beam 4-4 and a four-bar linkage mechanism 4-1 connecting the swing beam 4-4 and the L-shaped base 1, the four-bar linkage mechanism 4-1 is formed by connecting the flexible hinge I4-2 , an outpu...

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Abstract

The invention discloses a piezoelectric driving single-arm type high-speed lead wire clamp. The wire clamp is integrally formed by cutting board wires. The wire clamp comprises an L-shaped base body, wherein a parallelogram mechanism and a bridge-type displacement amplifying mechanism are formed on the inner side of the L-shaped base body; a piezoelectric ceramic driver is arranged between the input end of the bridge-type displacement amplifying mechanism and the L-shaped base body; the parallelogram mechanism is provided with an output end and an input end, a connecting beam vertical to the parallelogram mechanism is formed on the output end of the parallelogram mechanism, a movable jaw is formed on the end part, far away from the L-shaped base body, of the connecting beam, the movable jaw is provided with a corresponding fixed jaw, and the fixed jaw is formed on the top of the L-shaped base body; and the output end of the bridge-type displacement amplifying mechanism is connected with the input end of the parallelogram mechanism through a flexible hinge III. The piezoelectric driving single-arm type high-speed lead wire clamp is small in size, compact in structure, stable and reliable in clamping force and low in manufacturing cost, has a bigger displacement amplification factor, can realize measurement and feedback of clamping force, and is applicable for lead wire bonding packaging equipment.

Description

technical field [0001] The invention belongs to the field of micro-device packaging, in particular to a piezoelectric-driven single-arm high-speed lead clamp. Background technique [0002] In recent years, with the vigorous development of the microelectronics industry, the development of the microelectronics industry has become an important symbol to measure the comprehensive strength of a country, and an important guarantee to promote the sustainable development of the national economy and the security of the national strategic basic industry. With the continuous development of the microelectronics industry, devices in related industries are constantly developing towards miniaturization, high performance and high integration, and the quality requirements for packaging products are becoming more and more stringent. Therefore, more requirements are put forward for the quality and efficiency of micro device packaging. high demands. [0003] The so-called micro-device packagin...

Claims

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Application Information

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IPC IPC(8): H01L21/60
CPCH01L24/78H01L2224/78631H01L2224/7892
Inventor 梁存满王福军田延岭张大卫
Owner TIANJIN UNIV
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