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Piezoelectric actuated two-arm type high-speed lead wire clamp

A piezoelectric driven, double-arm technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of difficult to stabilize and control the clamping force, complex force calibration process, etc., to achieve clamping force measurement and Feedback, overall mass and motion inertia reduction, high displacement resolution effects

Inactive Publication Date: 2016-03-02
TIANJIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These methods will be affected by inertial force during the movement process, it is difficult to accurately ensure the stability and controllability of the clamping force, and the force calibration process is more complicated

Method used

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  • Piezoelectric actuated two-arm type high-speed lead wire clamp
  • Piezoelectric actuated two-arm type high-speed lead wire clamp
  • Piezoelectric actuated two-arm type high-speed lead wire clamp

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Embodiment Construction

[0016] In order to further understand the invention content, characteristics and effects of the present invention, the following examples are given, and detailed descriptions are as follows in conjunction with the accompanying drawings:

[0017] see Figure 1 to Figure 5 , a piezoelectric-driven dual-arm high-speed lead wire clip, which is integrally formed by wire cutting of a plate, includes a base 1, and two symmetrical parallelogram mechanisms 2 and 2 are formed on one side of the base 1. A bridge-type displacement amplifying mechanism 4; the bridge-type displacement amplifying mechanism 4 is located between the two parallelogram mechanisms 2, and the bridge-type displacement amplifying mechanism 4 is formed with a beam 4-4 parallel to the substrate 1 and Two four-bar linkage mechanisms 4-1 connecting the beam 4-4 and the base body 1, the four-bar linkage mechanism 4-1 is formed by connecting the flexible hinge I4-2, and the two four-bar linkage mechanisms An output end 4...

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Abstract

The invention discloses a piezoelectric actuated two-arm type high-speed lead wire clamp. The piezoelectric actuated two-arm type high-speed lead wire clamp is molded integrally through linear cutting of a board and comprises a base body; two parallelogram mechanisms which are in forward-backward symmetry and a bridge-shaped displacement amplification mechanism are formed at one side of the base body; a piezoelectric ceramic actuator is arranged in the bridge-shaped displacement amplification mechanism; each parallelogram mechanism is provided with an output end and an input end; a connecting beam which is vertical to each parallelogram mechanism is formed at the output end of the parallelogram mechanism; a jaw is formed at the end part, far away from the base body, of the connecting beam; and the output end of the bridge-shaped displacement amplification mechanism is connected with the input end of the parallelogram mechanism at the outside through a flexible hinge III. The piezoelectric actuated two-arm type high-speed lead wire clamp is small in volume, compact in structure, steady and reliable in clamping force and low in manufacturing cost, has relatively great displacement amplification times, can realize measurement and feedback of the clamping force, and can be applicable for a lead bonding and packaging device.

Description

technical field [0001] The invention belongs to the field of micro-device packaging, in particular to a piezoelectric-driven double-arm high-speed lead clamp. Background technique [0002] In recent years, with the vigorous development of the microelectronics industry, the development of the microelectronics industry has become an important symbol to measure the comprehensive strength of a country, and an important guarantee to promote the sustainable development of the national economy and the security of the national strategic basic industry. With the continuous development of the microelectronics industry, devices in related industries are constantly developing towards miniaturization, high performance and high integration, and the quality requirements for packaging products are becoming more and more stringent. Therefore, more requirements are put forward for the quality and efficiency of micro device packaging. high demands. [0003] The so-called micro-device packagin...

Claims

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Application Information

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IPC IPC(8): B81C1/00H01L21/60
CPCB81C1/00015B81C2201/01H01L24/78H01L2224/78631H01L2224/7892
Inventor 梁存满王福军田延岭张大卫
Owner TIANJIN UNIV
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