Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Processing system having a polar structure for planar substrates

A technology for processing equipment and plane substrates, which is applied in the field of processing equipment for polar structures of plane substrates, can solve problems such as large base surface requirements, high cost and the like, and achieve the effect of high positioning accuracy

Active Publication Date: 2016-03-02
ASYS AUTOMATIC SYST
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

All in all, not only does a much greater base surface requirement result, but also the radial travel required for the handling device also means that the required positioning accuracy for transferring the wafers always comes at a very high cost, at least at the required speed. to achieve

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Processing system having a polar structure for planar substrates
  • Processing system having a polar structure for planar substrates
  • Processing system having a polar structure for planar substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] figure 1 For processing equipment with polar structures in accordance with Figure 4 The simplified sectional view of the section line I-I in shows a handling device 2 with a support device 3 and a vacuum transfer chamber 4 supported by the support device. A vacuum transfer chamber is a transfer chamber in which special conditions of the gas atmosphere can be maintained, also during the transfer (reference ambient conditions), up to the highest and highest cleanliness classes.

[0033] This transfer chamber is docked to the individual process stations 6 via a coupling device 5 , wherein the handling device 2 is coupled to the valve via a support device 3 , a vacuum transfer chamber 4 and (cf. the drawing) a coupling device 5 which is fixed in position relative to the vacuum transfer chamber 7 forms the central base module 8 of the processing plant 1 . For this base module 8 on a circle 9 around its central axis of rotation 10 (eg Figure 4 shown) is provided with a r...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a processing system having a polar structure for planar substrates having a central base module (8) having a vacuum transfer chamber for the substrates (34), wherein the vacuum transfer chamber (4) is borne freely swiveling, eccentric to the base module (8), via a rotary support (14) lying in the central region of the base module (8), centered to the base module (8), and is positioned connected in a sealed manner in connection layers to the process stations (6) which are spaced radially apart from the rotary support (14) and grouped around the base module (8).

Description

technical field [0001] The invention relates to a processing plant for polar structures of planar substrates according to claim 1, wherein the processing plant has a base module and process stations arranged in groups on a circle around its central axis of rotation, and In particular, handling devices, coupling devices and / or robots, including associated work processes and / or methods, can also be installed in such processing plants. Background technique [0002] Processing plants for planar substrates, such as wafers, are often formed by process stations arranged in groups around a basic module polarity (DE 198 31 032 A1). At least in these devices, which are not installed as a whole in a clean room isolated from the atmosphere and of a quality compatible with the processing technology, or are not installed in the corresponding space for reasons of size and cost, the components of the basic module are A vacuum transfer chamber, ie a transfer chamber, encloses a clean room i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67126H01L21/67167H01L21/67196H01L21/67742H01L21/67748H01L21/67772
Inventor K.霍伊格勒
Owner ASYS AUTOMATIC SYST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com