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Processing method of PCB line sidewall

A technology of PCB board and processing method, which is applied in the field of processing the side wall of PCB board circuit, can solve the problems of low flatness and large signal loss of the side wall of PCB board circuit, and achieve the effect of ensuring flatness and less signal loss

Inactive Publication Date: 2016-03-09
CHONGQING FOUNDER HI TECH ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is that the flatness of the circuit side wall of the PCB board in the prior art is low so that the signal loss in the signal transmission process is large, thereby providing a kind of processing to the circuit side wall that can reduce the signal loss of the PCB board Method, and PCB board with little signal loss and the preparation method of the PCB board

Method used

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  • Processing method of PCB line sidewall
  • Processing method of PCB line sidewall

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Effect test

Embodiment 1

[0046] The present embodiment provides a kind of processing method of circuit side wall of PCB board, as figure 1 shown, including the following steps:

[0047] S11: performing at least one microetching treatment on the circuit sidewall of the substrate;

[0048] S12: Detect whether the flatness of the sidewall of the circuit is qualified; if the flatness of the sidewall of the circuit is qualified, stop the micro-etching (ie step S13); if the flatness of the sidewall of the circuit is unqualified, return to step S11.

[0049] The processing method of the circuit side wall of the PCB board of the present embodiment utilizes the micro-etching solution to carry out multiple treatments to the copper plating on the circuit side wall, and constantly detects the flatness of the circuit side wall. Stop micro-etching when the flatness is qualified, so as to ensure the flatness of the side wall of the PCB board, so that the signal loss of the prepared PCB board is very small during si...

Embodiment 2

[0072] The present embodiment provides a kind of preparation method of PCB board, comprises the steps:

[0073] Form holes on the substrate of the PCB board;

[0074] forming a copper plating layer on the substrate;

[0075] forming a prefabricated circuit on the surface of the copper plating layer of the substrate;

[0076] The sidewall of the prefabricated circuit is treated by any one of the treatment methods for the sidewall of the PCB circuit provided in Embodiment 1.

[0077] In the PCB preparation method of this embodiment, when the prefabricated circuit is formed on the copper-plated layer of the substrate, any method for processing the side wall of the PCB circuit described in Embodiment 1 is used to process the side wall of the prefabricated circuit, so that the prefabricated The flatness of the side wall of the line is qualified to reduce the signal loss of the PCB board during signal transmission, thereby improving the performance of the signal transmission of th...

Embodiment 3

[0081] This embodiment provides a PCB board with a circuit, and the height difference between the highest convex point and the lowest concave point on the side wall of the circuit is less than or equal to 1 μm, so that the flatness on the circuit side wall of the PCB board meets the requirements, and the PCB board is reduced. Signal loss during signal transmission, thereby improving the signal transmission performance of the PCB board.

[0082] Specifically, the PCB board provided in this embodiment can be prepared by the preparation method described in Embodiment 2, or can be prepared by other preparation methods.

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Abstract

The present invention provides a processing method of a PCB line sidewall. The method comprises the steps of carrying out at least one micro-etching process on the line sidewall of a substrate, detecting whether the flatness of the line sidewall is qualified or not, stopping the micro-etching process if the flatness is qualified, and carrying out micro-etching process on the line sidewall if the flatness is unqualified until the flatness is qualified. According to the method, the plated copper of the line sidewall is processed for multiple times by using a micro-etching solution, the degree of each time of etching is controlled strictly, through continuously detecting the flatness of the line sidewall, whether the flatness is qualified or not is determined, the etching is stopped as long as the qualified flatness of the line sidewall is detected, in this way the flatness of the PCB line sidewall can be ensured, thus the signal loss of a prepared PCB in a signal transmission process is reduced, and the requirements of PCB signal transmission by different fields can be satisfied.

Description

technical field [0001] The invention relates to the technical field of PCB board preparation, in particular to a method for processing the circuit side wall of a PCB board. Background technique [0002] With the continuous development and application of PCB boards, people have higher and higher requirements for the signal transmission rate of PCB boards and signal loss during signal transmission, especially under high-speed signal conditions, the requirements for PCB board signal loss are higher. When the PCB board is used as a circuit board, the signal transmission is carried out along the side wall of the line, and the signal loss depends largely on the flatness of the side wall of the line. The higher the flatness of the side wall of the line, the corresponding The less the signal loss of the PCB board during the transmission process; on the contrary, the lower the flatness of the side wall of the line, the greater the signal loss. [0003] The preparation method of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/002H05K2203/1476
Inventor 周明镝黄云钟
Owner CHONGQING FOUNDER HI TECH ELECTRONICS
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