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Lead frame soaking equipment

A technology of lead frame and equipment, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of not being able to fully immerse in the treatment liquid, affecting the soaking effect, and unsuitable lead frames, etc., to achieve good treatment effect and best treatment effect of effect

Active Publication Date: 2018-01-12
SHANGHAI SINYANG SEMICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The limitation of occupied space in the prior art results in a shorter chemical soaking time, thus affecting the soaking effect
In the existing lead frame soaking equipment, the lead frame is partly soaked in the chemical treatment solution and cannot be completely immersed in the treatment solution, which is not suitable for some lead frames

Method used

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  • Lead frame soaking equipment
  • Lead frame soaking equipment
  • Lead frame soaking equipment

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0033] The present invention is described in detail below in conjunction with accompanying drawing:

[0034] Such as Figures 1 to 4 As shown, it is a lead frame soaking device 100 provided by the present invention. The lead frame soaking equipment 100 includes the discharging device, the retrieving device and a processing tank 103 . The lead frame soaking device 100 includes a tank body 101 , a transmission mechanism 110 , a holding mechanism 120 and a power device 130 . The discharging device includes a first clamping manipulator 105 . The first clamping manipulator 105 is disposed above the tank body 101 . The first clamping manipulator 105 is set up and down and can move horizontally. The retrieving device includes a second clamping manipulator 107 . The second clamping manipulator 107 is disposed above the tank body 101 . The second clamping manipulator 107 is set up and down and can move horizontally.

[0035] Such as figure 2 As shown, the present invention fur...

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PUM

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Abstract

The invention discloses lead frame soaking equipment. The lead frame soaking equipment comprises a material taking-in device, a processing trough and a material taking-out device. The processing trough comprises a trough body, a transmission mechanism and a fixed holding mechanism. The trough body is provided with a trough chamber for filling chemical treatment liquid. The transmission mechanism is arranged in the trough chamber of the trough body. The fixed holding mechanism comprises at least two spacing members. Two adjacent spacing members are separately arranged and furthermore the distance between the adjacent spacing members is larger than or equal with the thickness of a semiconductor lead frame. The material taking-in device comprises a first clamping manipulator. The first clamping manipulator is arranged above the trough body. The first clamping manipulator is liftable and is movable in a horizontal plane. The second holding manipulator is arranged above the trough body. The second clamping manipulator is liftable and is movable in the horizontal plane. The lead frame soaking equipment realizes more comprehensive processing on the lead frame.

Description

technical field [0001] The invention relates to a processing device for a semiconductor lead frame, in particular to a lead frame soaking device. Background technique [0002] In the field of integrated circuits, it is generally necessary to use semiconductor lead frames as carriers for integrated circuit chips. The semiconductor lead frame uses bonding materials such as gold wire, aluminum wire, and copper wire to realize the electrical connection between the lead-out end of the chip's internal circuit and the external lead, forming a key structural part of the electrical circuit, which acts as a bridge connecting the external wire. Due to the high-precision production requirements of integrated chips, semiconductor lead frames are required to be smooth without burrs. Therefore, chemical soaking is generally required to facilitate further processing. The limitation of occupied space in the prior art results in a short chemical soaking time, thus affecting the soaking effe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/48
CPCH01L21/48H01L21/4821H01L21/67011H01L21/67017H01L21/67144
Inventor 黄春杰黄利松张超
Owner SHANGHAI SINYANG SEMICON MATERIALS