Continuous phase change heat sink thermal control unit

Abstract

The invention discloses a continuous phase change heat sink thermal control unit and aims to provide a phase change material thermal control unit simple in principle and low in realization cost. The thermal control unit is realized by the following technical scheme: a conical spring for supporting a pre-tightening pressure plate is arranged at the bottom end of a sealed cavity of a packaging shell; a phase change material is arranged between a heat diffusion plate and the pre-tightening pressure plate; the phase change material is closely pressed on the heat diffusion plate through pre-tightening force of the conical spring; in a phase change process, a heat source is transmitted to the phase change material for phase change through the heat diffusion plate, so that the phase change material at an interface of the phase change material and the heat diffusion plate is softened; the conical spring transmits the pre-tightening force of the spring to the interface of the phase change material and the heat diffusion plate through the pre-tightening pressure plate, so that the softened and molten phase change material is pushed and extruded out of the interface of the heat diffusion plate and the phase change material, and the phase change material is discharged to one side of the conical spring from a gap between the pre-tightening pressure plate and the packaging shell; and the phase change material is thinned under the action of spring force of the conical spring, and continuous melting phase change of continuous thinning is generated, so that efficient heat transmission and energy storage are realized.

Description

technical field [0001] The invention relates to a phase change heat sink which utilizes the principle of phase change heat transfer to transfer heat to electronic equipment. Background technique [0002] With the high frequency and high speed of electronic devices and the rapid development of integrated circuit technology and technological progress, the total power density of electronic components has increased significantly while the physical size has become smaller and smaller, and the heat flux has also increased. Therefore, high temperature The temperature environment will inevitably affect the performance of electronic components, which requires more efficient thermal control. Therefore, effectively solving the heat dissipation problem of electronic components has become a key technology in the manufacture of electronic components and electronic equipment. With the rapid development of microelectronics technology, the miniaturization of electronic devices has become th...

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Problems solved by technology

[0003] The purpose of the present invention is to aim at the deficiencies of the existing technology, to provide a continuous phase change heat sink heat control unit with simple principle, low cost and phase change materials, so as to overcome the high cost of traditional modified phase change materials and technical problems. Difficult implementation and poor technical economy

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