Tray and bearing device

Abstract

The invention provides a tray and a bearing device. The tray includes a tray body and an insulator located on the tray body; a plurality of processing position for bearing substrates are arranged on the insulator, and attraction electrodes are arranged in the insulator; the number and the positions of the attraction electrodes are in one-to-one corresponding to the number and the positions of the substrates; the attraction electrodes are electrically connected to a DC power supply through a plate electrode layer under the attraction electrodes to fix the substrates corresponding to the attraction electrodes in an electrostatic attraction manner; and the area of the substrates are greater than that of the attraction electrodes corresponding to the substrates to shelter the attraction electrodes. The tray can improve the pressure-tolerant performance of a zone of the insulator which is not sheltered by the substrates, and the possibility of a breakdown of the insulator can be reduced while the output voltage of the DC power supply is improved to ensure electrostatic attraction power, so that the service life of the tray can be improved, and the input cost can be reduced and the economic benefits can be improved.

Description

technical field [0001] The invention belongs to the technical field of microelectronic processing, and in particular relates to a tray and a carrying device. Background technique [0002] Patterned Sapphire Substrate (Patterned Sapphire Substrate, hereinafter referred to as PSS) is currently the mainstream substrate for improving the light output efficiency of LED devices. Dry etching technology is usually used to etch the sapphire substrate with mask pattern to obtain the image. sapphire substrate. During the PSS etching process, in order to increase the productivity of a single process, a tray is usually used to carry multiple substrates and transfer them to the electrostatic chuck in the reaction chamber, so that multiple substrates can be processed simultaneously. [0003] figure 1 It is a structural schematic diagram of an existing pallet. see figure 1 , the tray 10 includes a tray body 11 and a ceramic body 12 positioned on the tray body 11, and a plurality of bear...

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned tray 10 inevitably has the following problems in practical applications: since the material of the substrate S is a sapphire substrate, its electrostatic adsorption is relatively difficult and requires a large electrostatic adsorption force, so the output voltage of the DC power supply DC is often required greater than 3000V, and in order to further ensure the adsorption force to the substrate S, the thickness of the plate electrode layer 13 from the upper surface of the ceramic body 12 is generally 0.1mm, which makes the withstand voltage value of the upper ceramic body 121 generally about 3000V. Under the circumstances, the region corresponding to the substrate S of the upper ceramic layer 121 is not easy to be broken down due to being shielded by the substrate S during the process, while the region of the upper ceramic layer 121 that is not shielded by the substrate (such as figure 2 The middle shaded area) will withstand the above-mentioned voltage greater than 3000V, making it easy to be broken down, resulting in a low service life of the tray, resulting in high input costs and low economic benefits

Images