Release sheet and backing sheet laminate using same
A release sheet and backing sheet technology, which is applied in the field of backing sheet laminates, can solve the problems of the object to be ground, the object to be ground cannot be placed and fixed, and the accuracy cannot be stabilized.
Active Publication Date: 2017-10-13
SEKISUI CHEM CO LTD
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- Description
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Problems solved by technology
[0005] In addition, when using the backing sheet, while peeling the release sheet from the backing sheet laminate, the backing sheet is fixed to the lower platen with an adhesive layer that is laminated and integrated on one surface. , but as mentioned above, the backing sheet is formed of a material with stiffness such as a foam sheet, so the stiffness is weak, and it is easy to cause wrinkles on the backing sheet when it is arranged and fixed on the platen. When wrinkles occur on the backing sheet, The object to be ground cannot be stably placed and fixed on the backing sheet, and the object to be ground cannot be ground stably and precisely
Method used
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Embodiment 1～11、 comparative example 1～3
[0082] From a backing sheet (thickness: 800 μm) composed of a polyurethane-based resin foam sheet (thickness: 800 μm) in which cell cross-sections are exposed on the surface, a backing sheet 1 of a plane square with a side of 3500 mm was cut out.
[0083] Corona discharge treatment was performed on both surfaces of a polyester resin film (trade name "E5200" manufactured by Toyobo Co., Ltd.) with a thickness of 75 μm in a plane square with a side of 3500 mm, and then the adhesive containing an acrylic adhesive The mixture solution is coated on both surfaces of the polyester resin film and dried to manufacture an acrylic adhesive layer 32 with a thickness of 50 μm, and the acrylic adhesive layer 32 is laminated and integrated on the polyester resin film. Double-sided adhesive tape 3 made of two surfaces of a resin-like film.
[0084] An adhesive solution containing an acrylic adhesive was coated on one surface (first surface) of a polyethylene terephthalate film 41 and allowed t...
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Abstract
The present invention provides a release sheet, which imparts stiffness to the backing sheet laminate, can improve the applicability of the backing sheet laminate, and does not cause damage to the backing sheet laminate when the backing sheet laminate is wound. On the surface of the backing sheet, dents were formed at the beginning of winding of the backing sheet laminate. The release sheet of the present invention is used by being releasably arranged on an adhesive layer that is laminated and integrated on a backing sheet that is used between the object to be polished and the platen, and is characterized in that, The release sheet is rectangular and has a width of more than 2.4 m and an overall thickness of 190 μm or less, and includes: a sheet body and a release agent layer that is laminated and integrated on both surfaces of the sheet body, so The sheet main body includes a polyester resin film with a thickness of 10-60 μm and a paper substrate laminated and integrated on the polyester resin film.
Description
technical field [0001] The present invention relates to a release sheet and a backing sheet laminate using the release sheet, wherein the release sheet is releasably laminated on an adhesive layer integrally provided for The object to be polished is fixed on the back surface of the backing sheet on the platen of a polishing device for polishing objects to be polished such as semiconductor wafers and liquid crystal glass. Background technique [0002] For the purpose of increasing the density of semiconductor integrated circuits, miniaturization of wiring occurs, and it is necessary to planarize as much as possible the unevenness of the surface of a semiconductor wafer, a glass substrate for liquid crystal, or the like. As for the object to be polished, the size of the object to be polished is increased in order to enlarge the screen of the liquid crystal or reduce the manufacturing cost. With the increase of the size of the object to be polished, the backing used to fix the ...
Claims
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IPC IPC(8): B32B27/00B24B37/30B32B27/10B32B27/36C09J7/02H01L21/304C09J7/21
CPCB24B37/30B32B27/10B32B27/36B32B7/06B32B7/12B32B2307/51B32B2307/748B32B2457/14B32B2457/202C09J2203/318C09J2203/326C09J7/201C09J7/21B32B7/02
Inventor 酒井贤司松井梨绘
Owner SEKISUI CHEM CO LTD