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Flexible printed substrate for mounting light emitting component, and flexible printed substrate mounted with light emitting component

A flexible printed circuit board and light-emitting component technology, which is applied in the directions of circuit optical components, lighting device components, printed circuits, etc., to achieve the effect of suppressing the change of light tone, suppressing the change of color tone, and suppressing the transmission of light

Inactive Publication Date: 2016-03-30
TOYO ALUMINIUM KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the above-mentioned FPC, epoxy resin is blended as the adhesive resin composition forming the adhesive layer. In addition, the thickness of the base film and adhesive layer remaining after removing the metal layer (copper foil) The maximum thickness is about 100 μm, and there is a problem of transmitting light from light-emitting parts such as LEDs

Method used

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  • Flexible printed substrate for mounting light emitting component, and flexible printed substrate mounted with light emitting component
  • Flexible printed substrate for mounting light emitting component, and flexible printed substrate mounted with light emitting component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] The 35-micrometer-thick electrolytic copper foil and the 38-micrometer-thick polyethylene terephthalate film were bonded together using the adhesive resin composition, and the laminated body was produced. The adhesive resin composition is prepared by mixing 100 parts by mass of DIC Co., Ltd. trade name: LX500 with 10 mass parts of DIC Co., Ltd. trade name KW75, and diluting with ethyl acetate. It was prepared by adding titanium dioxide with an average particle diameter of 0.24 μm.

[0069] An adhesive resin layer was produced by incubating the produced laminate at 60° C. for 5 days, and heating and curing the adhesive resin composition. The thickness of the adhesive resin layer was 15 μm, and the content of titanium dioxide in the adhesive resin layer was 30% by mass relative to 100% by mass of the adhesive resin layer. Moreover, the light transmittance of the wavelength 380-750nm of an adhesive resin layer was 42.2%. In addition, the light transmittance of the adhesi...

Embodiment 2

[0076] The light transmittance of the adhesive resin layer was measured in the same manner as in Example 1, except that the content of titanium dioxide in the adhesive resin layer was 15% by mass, and the color tone of the light was evaluated.

Embodiment 3

[0078] The light transmittance of the adhesive resin layer was measured in the same manner as in Example 1, except that the content of titanium dioxide in the adhesive resin layer was 10% by mass, and the color tone of the light was evaluated.

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Abstract

The present invention provides the following: a flexible printed substrate for mounting a light emitting component with which, even if the substrate is made thin to show flexibility, the transmission of light rays from the mounted light emitting component is suppressed and changes in the color of light due to the impact of light emitting components of different colors are suppressed; and a flexible printed substrate mounted with a light emitting element, in which a light emitting component is mounted on the flexible printed substrate for mounting a light emitting component. The present invention provides a flexible printed substrate for mounting a light emitting component, on which a metal foil is layered in a circuit pattern onto at least one side of an insulative base material with an adhesive resin interposed therebetween, and that is characterized in that the adhesive resin layer contains light-blocking particles and has a light transmission rate of 65% or less for wavelengths in the range 380-750 nm.

Description

technical field [0001] The present invention relates to a flexible printed circuit board for mounting a light-emitting component, that is, a flexible printed circuit board for mounting a light-emitting component, and a flexible printed circuit board with a light-emitting component mounted on the flexible printed circuit board. Background technique [0002] Conventionally, electronic products using light-emitting components such as LEDs have been manufactured. In such electronic products, for example, a circuit board on which LEDs are mounted is used as a surface light-emitting body for liquid crystal display applications, fluorescent tube replacement applications, etc. As such a circuit board for a surface light-emitting body, copper foil and A rigid substrate such as FR-4 or CEM-3, thermocompression-bonded glass cloth impregnated with resin. [0003] In recent years, as a substrate for LED mounting, it has been proposed to process a surface light-emitting body using a flex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03B32B15/08C09J11/04C09J175/04F21V19/00
CPCB32B7/12B32B15/08B32B27/08B32B27/20B32B27/281B32B27/288B32B27/36B32B27/38B32B27/40B32B2264/102B32B2264/104B32B2307/206B32B2457/00B32B2457/08C08K3/22C08K3/36C08K2003/2217C08K2003/2237C08K2003/2296C09J9/00C09J11/04C09J175/04H05K1/0274H05K1/189H05K3/386H05K2201/0209H05K2201/10106
Inventor 东山大树猿渡昌隆
Owner TOYO ALUMINIUM KK
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