Embedded system with high-capacity nonvolatile memory

Abstract

The invention relates to the field of memories, in particular to an embedded system with a high-capacity nonvolatile memory. The system comprises a system-on-chip chip and a 3D nonvolatile memory chip, wherein the system-on-chip chip and the 3D nonvolatile memory chip are packaged together through bonding wires or silicon through holes, so that the chip utilization rate of the high-capacity 3D nonvolatile memory is increased and the stock pressure and test cost of the high-capacity 3D nonvolatile memory are greatly reduced on the premise of ensuring that the reading speed is not reduced.

Description

technical field [0001] The invention relates to the field of memory, in particular to an embedded system including a large-capacity non-volatile memory. Background technique [0002] The type and selection decision of non-volatile memory in an embedded system largely determines the operation and performance of the overall embedded system. According to the location of the non-volatile programmable memory, there are two implementation methods. The first implementation method is as figure 1 shown. The SoC chip 1 has no programmable memory, but a programmable memory chip 3 is added on the circuit board 2, and the microprocessor core 4 in the SoC chip 1 accesses and executes the program in the programmable memory chip 3 through an external port 5 or data. This method significantly reduces the cost of the system-on-chip 1 , because no embedded programmable memory is integrated, on the one hand, the manufacturing cost is saved, and on the other hand, the area of ​​the chip is a...

AI Technical Summary

Problems solved by technology

The traditional situation of these low-yield chips will be discarded, wasting costs and increasing environmental pollution

Images