Printed circuit board and mobile terminal
A printed circuit board and current flow technology, which is applied in the direction of printed circuit, printed circuit, printed circuit components, etc., can solve the problem of increasing the thickness of printed circuit boards, which does not meet the development needs of thinner and thinner printed circuit boards, and the space limitation of power line wiring To achieve the effect of avoiding stacking or overflowing tin, ensuring the thickness of the traces, and improving the ability to carry current
Active Publication Date: 2016-04-06
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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Problems solved by technology
[0002] At present, in the field of printed circuit boards, due to the different currents of the data signal lines and power lines, the power lines need to carry a larger current. The wiring on the printed circuit board usually increases the current carrying capacity by increasing the width of the wiring. Or trace thickness to achieve, so people in the industry have arranged the data signal line and power line on different layers, the power line on a single layer can increase the current carrying capacity by increasing the thickness and width of the power line, but it will also make the The increased thickness of printed circuit boards does not meet the development needs of thinner printed circuit boards
There are also data signal lines and power lines arranged on the same layer, and then the current carrying capacity is increased by increasing the width of the power line, but with the continuous improvement of the wiring density of the printed circuit board, the wiring space of the power line is also limited
Method used
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[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.
[0024] see figure 1 , figure 2 and image 3 , figure 1 A schematic cross-sectional structure diagram of a printed circuit board provided by an embodiment of the present invention, figure 2 It is a schematic top view structural diagram of a printed circuit board provided by an embodiment of the present invention, image 3 for figure 2 An enlarged schematic view of the structure at A. The printed circuit board described in the embodiment of the present invention includes a substrate layer 1, a circuit layer 2 and an insulating layer 3 which are sequentially stacked. The circuit layer 2 includes signal lines and power lines 21. The position of the power line 21 is provided with a grid hollow gap, and the tin material 4 is filled in the grid hollow gap.
[0025] In this ...
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The invention discloses a printed circuit board. The printed circuit board comprises a substrate layer, a circuit layer and an insulating layer that are stacked in sequence, wherein the circuit layer comprises a signal line and a power line; a grid hollow-out nick is formed in a position, facing to the position of the power line, in the insulating layer; and the grid hollow-out nick is filled with a tin material. The printed circuit board provided by the invention is provided with the power line with high current carrying capability. The invention also discloses a mobile terminal.
Description
technical field [0001] The invention relates to the field of printed circuit boards, in particular to a printed circuit board with a power cord with large current carrying capacity and a mobile terminal. Background technique [0002] At present, in the field of printed circuit boards, due to the different currents of the data signal lines and power lines, the power lines need to carry a larger current. The wiring on the printed circuit board usually increases the current carrying capacity by increasing the width of the wiring. Or trace thickness to achieve, so people in the industry have arranged the data signal line and power line on different layers, the power line on a single layer can increase the current carrying capacity by increasing the thickness and width of the power line, but it will also make the The increase in the thickness of the printed circuit board does not meet the development requirements for thinner and thinner printed circuit boards. There are also dat...
Claims
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IPC IPC(8): H05K1/02
CPCH05K1/0265H05K2201/09681
Inventor 黄占肯
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD