Unlock instant, AI-driven research and patent intelligence for your innovation.

A printed circuit board pressing process

A printed circuit board and process technology, applied in the direction of printed circuit, multilayer circuit manufacturing, electrical components, etc., can solve the problem of easy cracking of glass fiber mechanical extrusion

Active Publication Date: 2019-04-19
SHENNAN CIRCUITS
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a printed circuit board lamination process, which can solve the problem that the glass fiber is easy to break when it is mechanically extruded due to the peaks formed by etching during lamination.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A printed circuit board pressing process
  • A printed circuit board pressing process
  • A printed circuit board pressing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0055] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0056] The terms "first", "second", "third" and "fourth" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily to describe a specific order or sequentially. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
etching depthaaaaaaaaaa
Login to View More

Abstract

The embodiment of the invention provides a printed circuit board lamination process, which comprises the steps of: covering a second surface of a copper foil surface with a corrosion resisting film; performing micro-etching treatment on a first surface to reduce the thickness of copper foil, and removing the corrosion resisting film; printing resin on a copper foil circuit on the first surface after micro-etching treatment; pre-curing the copper foil printed with the resin in a segmented manner; adhering a first prepreg with the first surface which faces the first prepreg; and adhering a first substrate with the first prepreg, and then carrying out first lamination operation. The printed circuit board lamination process solves the problem that glass fibers are prone to crack in mechanical squeezing due to flash formed by etching during lamination in the prior art is solved.

Description

technical field [0001] The invention relates to the field of PCB (Printed circuit board) printed circuit board manufacturing, in particular to a printing circuit board pressing process. Background technique [0002] As the design of electronic products becomes more and more complex, the required copper foil is thicker, the lines are denser, the carrying current is larger and the withstand voltage requirements are higher and higher. Therefore, in the multilayer PCB board manufacturing process, it is necessary to consider Overload current, the greater the thickness of the copper foil, the greater the current it can carry. For example, 2OZ (ounce ounces) is thicker than 1OZ. It is necessary to laminate the PCB core board components after electroplating and etching. Generally, conventional PP (Prepreg That is, the resin sheet, prepreg) lamination process, and the combination of printing resin filling process and PP lamination process, [0003] However, the conventional PP lamin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/00
Inventor 黄立球刘宝林
Owner SHENNAN CIRCUITS