Heat conduction paint

Abstract

The invention discloses heat conduction paint. The heat conduction paint comprises, by weight, 10-25 parts of melamino-formaldehyde resin, 15-20 parts of epoxy organic silicone resin, 5-15 parts of an aliphatic dibasic ester mixture DBE, 10-20 parts of a solvent, 20-30 parts of an inorganic filling material and 1-5 parts of an auxiliary agent. The heat conduction paint can satisfy coating requirements on surfaces of a plurality of materials such as plastic, metals and wood, has good adhesion to the surfaces, can form a coating with uniform thickness and has good universality.

Description

technical field [0001] The invention relates to the field of coatings, in particular to a heat-conducting coating. Background technique [0002] The current problem of heat conduction and heat dissipation has become a restrictive factor for the development of high-power electronic devices. At present, the thermal controls used in electronic devices generally use metal materials, but such materials are heavy in weight and have a large thermal expansion coefficient, which greatly limits their wide use as packaging heat dissipation materials. Although thermal controls of other lightweight materials have been used a lot, they often have the problem of low thermal conductivity. If the thermal control can improve the thermal conductivity of the coating layer, the thermal conductivity of the thermal control can be further improved as a whole. [0003] Therefore, prior art needs further improvement. Contents of the invention [0004] The object of the present invention is to pro...

AI Technical Summary

Problems solved by technology

At present, the thermal controls used in electronic devices generally use metal materials, but such materials are heavy in weight and have a large thermal expansion coefficient, which greatly limits their wide use as packaging heat dissipation materials.

Although thermal controls of