Heat conduction paint

A technology of thermally conductive coatings and inorganic fillers, which is applied in the direction of coating, etc., can solve the problems of restricting the wide use of heat dissipation materials for packaging, large thermal expansion coefficient, and low thermal conductivity, and achieve the effects of good coating, good adhesion, and strong versatility

Inactive Publication Date: 2016-04-13
李晓念
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the thermal controls used in electronic devices generally use metal materials, but such materials are heavy in weight and have a large thermal expansion coefficient, which greatly limits their wide use as packaging heat dissipation materials.
Although thermal controls of

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The heat-conducting coating is composed of the following components in parts by weight:

[0036] 20 parts of melamine formaldehyde resin;

[0037] 20 parts of epoxy silicone resin;

[0038] 10 parts of dimethyl mixed diacid;

[0039] 15 parts of solvent;

[0040] 25 parts of inorganic fillers;

[0041] 5 parts of auxiliary agent.

[0042] The inorganic filler is composed of aluminum nitride and dolomite, and the weight ratio of the two is 1:1; wherein, the particle size of the aluminum nitride is 10-30 microns, and the particle size of the dolomite is 1-3 microns. ,

[0043] Wherein, the solvent includes ethylene glycol ether acetate and xylene, and the weight ratio of the two is 1:1 according to the amount used.

[0044] The preparation method of the heat-conducting coating is as follows: when preparing, weigh the raw materials according to the above formula, use a high-speed disperser at a speed of 1500 rpm, stir and disperse for 15 minutes, then use a sand mill...

Embodiment 2

[0047] The heat-conducting coating is composed of the following components in parts by weight:

[0048] 25 parts of melamine formaldehyde resin;

[0049] 15 parts of epoxy silicone resin;

[0050] 10 parts of dimethyl mixed diacid;

[0051] 20 parts of solvent;

[0052] 30 parts of inorganic filler;

[0053] 1 part of auxiliary agent.

[0054] The inorganic filler is composed of aluminum nitride and dolomite, and the weight ratio of the two is 1:1; wherein, the particle size of the aluminum nitride is 10-30 microns, and the particle size of the dolomite is 1-3 microns. ,

[0055] Wherein, the solvent includes ethylene glycol ether acetate and xylene, and the weight ratio of the two is 1:1.5 according to the amount used.

[0056] The preparation method of the heat-conducting coating is as follows: when preparing, weigh the raw materials according to the above formula, use a high-speed disperser at a speed of 1800 rpm, stir and disperse for 15 minutes, then use a sand mill...

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PUM

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Abstract

The invention discloses heat conduction paint. The heat conduction paint comprises, by weight, 10-25 parts of melamino-formaldehyde resin, 15-20 parts of epoxy organic silicone resin, 5-15 parts of an aliphatic dibasic ester mixture DBE, 10-20 parts of a solvent, 20-30 parts of an inorganic filling material and 1-5 parts of an auxiliary agent. The heat conduction paint can satisfy coating requirements on surfaces of a plurality of materials such as plastic, metals and wood, has good adhesion to the surfaces, can form a coating with uniform thickness and has good universality.

Description

technical field [0001] The invention relates to the field of coatings, in particular to a heat-conducting coating. Background technique [0002] The current problem of heat conduction and heat dissipation has become a restrictive factor for the development of high-power electronic devices. At present, the thermal controls used in electronic devices generally use metal materials, but such materials are heavy in weight and have a large thermal expansion coefficient, which greatly limits their wide use as packaging heat dissipation materials. Although thermal controls of other lightweight materials have been used a lot, they often have the problem of low thermal conductivity. If the thermal control can improve the thermal conductivity of the coating layer, the thermal conductivity of the thermal control can be further improved as a whole. [0003] Therefore, prior art needs further improvement. Contents of the invention [0004] The object of the present invention is to pro...

Claims

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Application Information

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IPC IPC(8): C09D161/28C09D183/06C09D7/12
Inventor 李晓念
Owner 李晓念
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