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Polyimide precursor and polyimide

A polyimide precursor, chemical imidizing agent technology, applied in printed circuits, coatings, electrical components, etc., can solve the problems of reduced heat resistance, low temperature, etc., to achieve excellent performance, low linear thermal expansion coefficient, the effect of improving heat resistance

Active Publication Date: 2016-04-13
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Non-Patent Document 5 also discloses that the 5% weight reduction temperature (T 5％ ) is lower and has reduced heat resistance (page 4162, right column, rows 8-6 from bottom)

Method used

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  • Polyimide precursor and polyimide
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  • Polyimide precursor and polyimide

Examples

Experimental program
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Effect test

preparation example Construction

[0116] For solvents used in the preparation of polyimide precursors, aprotic solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, 1-methyl-2-pyrrolidone, 1- Ethyl-2-pyrrolidone, 1,1,3,3-tetramethylurea, 1,3-dimethyl-2-imidazolinone and dimethylsulfoxide are preferred, e.g. N,N-dimethyl Acetamide and 1-methyl-2-pyrrolidone are particularly preferred. However, any solvent may be used as long as the starting monomer components and the formed polyimide precursor can be dissolved in the solvent, and the solvent is not limited to the structure. Examples of preferred solvents employed include amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and 1-methyl-2-pyrrolidone; cyclic ester solvents such as γ-butyrol Esters, γ-valerolactone, δ-valerolactone, γ-caprolactone, ε-caprolactone and α-methyl-γ-butyrolactone; carbonate solvents such as ethylene carbonate and propylene carbonate; Glycol solvents such as triethylene glycol; phenolic solvents such as m-cre...

Embodiment 19

[0182] The degree of imidization of Example 19 was calculated by Equation (I) to be 38.5%.

[0183] Degree of imidization (%)=[1-(1.23 / 7)×{1 / (2 / 7)}]×100

[0184] =38.5

[0185]

[0186] [Light transmittance at 400nm, total light transmittance]

[0187] The light transmittance at 400 nm and the total light transmittance (average light transmittance from 380 nm to 780 nm) of the polyimide film having a thickness of about 10 μm were measured using MCPD-300 model produced by Otsuka Electronics Co., Ltd. Light transmittance and total light transmittance at 400 nm of a polyimide film having a thickness of 10 μm On the assumption that the reflectance is 10%, the light transmittance measured at 400 nm and the total light transmittance measured using the Lambert-Beer formula Calculated from transmittance.

[0188] log 10 ((T 1 +10) / 100)=10 / L×(Log 10 ((T 1 '+10) / 100))

[0189] log 10 ((T 2 +10) / 100)=10 / L×(Log 10 ((T 2 '+10) / 100))

[0190] T 1 : The light transmittance at...

Embodiment 1

[0221] The TFMB of 2.000g (6.246mmol) is placed in reaction vessel, it is purged with nitrogen gas, and the DMAc of 32.8g is added thereto so that the total weight of charged monomer (the total weight of diamine component and carboxylic acid component ) was 20% by weight, and the mixture was stirred at room temperature for 1 hour. 1.600 g (4.164 mmol) of CpODA was gradually added to the resulting solution, and the mixture was stirred at 50° C. for 5 hours. Subsequently, the mixture was heated to 160° C., and 25 mL of toluene was added thereto, and the toluene was refluxed for 3 hours, then the toluene was extracted, and the resulting solution was cooled to room temperature to provide a solution containing an imide compound. The degree of polymerization (n) of the imide compound is 2 calculated from the amount of charged monomers, and both terminals are amino groups. 1.419 g (6.246 mmol) of DABAN were added to the solution, and the mixture was stirred at room temperature for 1 h...

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Abstract

A polyimide precursor consisting of a repeating unit represented by the following chemical formula (1): and a repeating unit represented by the following chemical formula (2): in which A is a tetravalent group of a tetracarboxylic acid, from which carboxyl groups have been removed; B is a divalent group of a diamine, from which amino groups have been removed; with the proviso that the A group and the B group contained in each repeating unit may be the same as, or different from each other; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, the amount of the repeating unit represented by the chemical formula (2) is 30 mol % or more and 90 mol % or less relative to the total repeating units, 50 mol % or more of the total amount of the B group in the chemical formula (1) and the chemical formula (2) is p-phenylene group and / or a specific divalent group containing two or more benzene rings, the polyimide precursor is produced by thermal imidization.

Description

technical field [0001] The present invention relates to a polyimide precursor from which a polyimide having a low coefficient of linear thermal expansion and having excellent heat resistance, solvent resistance and mechanical properties can be obtained. Background technique [0002] Polyimide has excellent heat resistance, solvent resistance (chemical resistance), mechanical properties, electrical properties, etc., and thus has been widely used in applications for electrical / electronic equipment, including flexible circuit boards and for TAB ( Reel and tape automatically combined) tape. For example, polyimide obtained from aromatic tetracarboxylic dianhydride and aromatic diamine, especially polyimide obtained from 3,3',4,4'-biphenyltetracarboxylic dianhydride and p-phenylenediamine is suitable for use. [0003] Meanwhile, research on polyimide as a substitute for glass substrates is progressing in the field of display devices. Replacing the glass substrate by a plastic s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
CPCC08G73/1007C08G73/1028C08G73/1039C08G73/1042C08G73/105C08G73/1067C08G73/1078C08G73/14C09D179/08H05K1/0346H05K2201/0154H05K2201/068C08G73/1046H05K1/0353
Inventor 冈卓也小滨幸德渡辺祥行久野信治
Owner UBE IND LTD
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