Suction nozzle for testing sorting machine

Abstract

The invention discloses a suction nozzle for a testing sorting machine. The suction nozzle comprises a suction nozzle body, which comprises a suction nozzle rod and a suction nozzle head, wherein vacuum runners are formed in the centers of the suction nozzle rod and the suction nozzle head; a detachable positioning protecting device is arranged on the suction nozzle body and comprises positioning protecting rods which are arranged on the two sides of the suction nozzle body and are parallel to the suction nozzle body. The suction nozzle for the testing sorting machine is simple in structure and easy to manufacture; the pin transformation of a semiconductor device is effectively avoided; the suction nozzle rod is connected with the suction nozzle head through a connector; the suction nozzle has the advantages of short repairing time, high product quality, and the like, and the long service life of the suction nozzle head is long; the suction nozzle is worthy of wide popularization.

Description

technical field [0001] The invention relates to semiconductor device packaging equipment, in particular to a suction nozzle for a testing and sorting machine. Background technique [0002] After the semiconductor device is manufactured, it needs to be inspected, marked, sorted, taped and packaged. In the traditional technology, the above-mentioned work processes are carried out independently. The detection and sorting speed is slow, and there are many equipments and Miscellaneous, heavy labor and low production efficiency. At present, most of them are mechanized by semiconductor device testing and sorting machines. When the sorting machine is working, the semiconductor device is loaded from the feeding mechanism, and then enters the separation table, and the suction nozzle goes down until the semiconductor device is sucked at the bottom of the suction nozzle. The structure of the existing suction nozzle is as follows: image 3 As shown, then the suction nozzle is lifted, th...

AI Technical Summary

Problems solved by technology

[0003] The suction nozzle structure of the existing sorting machine has the following disadvantages: First, during the upward and downward process of the suction nozzle sucking the semiconductor device, it is very easy for the suction nozzle to fail to suck the center position of the product, and the semiconductor device is caused by external force during the handling process. The pins of the pins are deformed, resulting in inconsistencies in the coplanarity of the pins. The suction nozzle is not equipped with a relevant positioning protection device, and a virtual soldering occurs when it is in contact with the test piece, which reduces the quality of the semiconductor device; second, the structure of the suction nozzle is a suction nozzle The rod and the slender nozzle head are integrated, and the nozzle head has a small bearing capacity, so it is easy to break when the material is jammed or subjected to external force, and the nozzle head cannot be replaced separately. Long, resulting in high testing costs and low production efficiency

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