Pretreatment device allowing air to be automatically discharged from IC card in thermolaminating process

Abstract

The invention discloses a pretreatment device allowing air to be automatically discharged from an IC card in the thermolaminating process. The pretreatment device comprises a rack and a material supporting plate, wherein a transverse partition is fixedly arranged at the middle of the rack; the material supporting plate is arranged on the transverse partition; the material supporting plate is fitted with the PETG cushion layer of the IC card; the pretreatment device is characterized in that a mobile positioning device is arranged above the material supporting plate; the upper part of the mobile positioning device is fixedly arranged at the lower part of the top plate of the rack through double-acting cylinders; punching needles corresponding to 32 modules of the PETG cushion layer are arranged on the bottom panel of the mobile positioning device; the double-acting cylinders are communicated with magnetic exchange valves through air pipes; the magnetic exchange valves are communicated with an air pump through an air pipe. According to the pretreatment device, the operation is convenient, hole punching is accurate and efficient, exhaust holes are unified in positions, the exhausting quality in the thermolaminating process is ensured, the labor intensity is reduced, and the production efficiency is improved.

Description

technical field [0001] The present invention relates to an IC card production auxiliary equipment, in particular to a pretreatment device for automatically exhausting the IC card during the thermal lamination process, which is beneficial to the discharge of the IC card PETG Inlays component layer during the thermal lamination process. Accumulated gas generated around the module. Background technique [0002] The production process of IC cards mainly includes seven links: punching, module filling, embedding, welding, printing, lamination and card cutting. The IC card Inlays component layer is on the PETG material (called the bearing layer) with a length of 512mm, a width of 402mm, and a thickness of 0.33mm. 32 module filling holes are punched according to the specified size. After the modules are filled, Use an ultrasonic winding machine to make a coil around the module, and then use a special welding machine to connect the coil and the module to form a physical circuit, and...

AI Technical Summary

Problems solved by technology

The module is composed of a base and vinyl. The size of the base is larger than that of the vinyl. The vinyl part of the module is embedded in the carrier layer, and the base with a thickness of about 0.1mm will protrude from the surface of the carrier layer, causing its surface to be covered again. When laying a flat layer, a certain cavity will be formed around the module to store a certain amount of air. If it is not discharged in time, air bubbles will be formed here during thermal lamination, which will affect the quality of the final product.

At present, in order to improve this defect, the method adopted is to manually use a needle cone to pierce two vent holes at the position of the module. Not uniform, which is time-consuming and labor-intensive, and can not achieve the ideal exhaust effect, can not achieve the purpose of improving product quality, and the efficiency is low

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