Heat abstractor

A technology of heat dissipation device and heat dissipation pipe, which is applied to electrical components, electric solid state devices, circuits, etc., and can solve problems such as changes in heat dissipation effect.

Inactive Publication Date: 2016-05-04
XIAOMI INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to solve the problem in the related art that the heat dissipation effect cannot chan

Method used

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  • Heat abstractor
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Embodiment Construction

[0024] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

[0025] figure 1 shows a heat dissipation device according to an exemplary embodiment, such as figure 1 As shown, the heat dissipation device includes: a heat pipe 1 , a coolant and a power assembly 2 . figure 2 shows the structure of the power pack 2, combined with figure 2 , the power assembly 2 includes a tube body 21, a pair of electrode plates 22 and a pair of magnets 23, one ...

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Abstract

The invention relates to a heat abstractor, and belongs to the technical field of heat dissipation. The heat abstractor comprises a heat-conducting pipe, a cooling liquid and a power component, wherein the power component comprises a pipe body, a pair of electrode plates and a pair of magnets; one end of the pipe body is connected with one end of the heat-conducting pipe; the other end of the pipe body is connected with the other end of the heat-conducting pipe; the pipe body is communicated with the heat-conducting pipe to form a closed cavity; the cooling liquid is arranged in the cavity and is an electrolyte solution; the pair of electrode plates is arranged in the pipe body; the pair of magnets is arranged outside the pipe body; and when the pair of electrode plates is electrified, a magnetic line between the pair of magnets intersects a power line between the pair of electrode plates. According to the heat abstractor, the flow velocity of the electrolyte solution is adjusted by adjusting the current intensity between the pair of electrode plates, so that the role of controlling the heat dissipation effect of the heat abstractor is put into a play.

Description

technical field [0001] The present disclosure relates to the technical field of heat dissipation, in particular to a heat dissipation device. Background technique [0002] With the continuous improvement of the performance of electronic equipment, the power consumption and calorific value of its processor are also getting higher and higher. To dissipate heat. However, during the working process of electronic equipment, the temperature of the processor changes at any time, but whether it is a heat sink or a heat pipe, its heat dissipation effect is relatively stable, and it cannot change with the temperature of the processor. the needs of the people. Contents of the invention [0003] In order to solve the problem in the related art that the heat dissipation effect cannot change with the temperature of the heat source, the present disclosure provides a heat dissipation device. [0004] According to the first aspect of an embodiment of the present disclosure, there is pro...

Claims

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Application Information

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IPC IPC(8): H01L23/473
CPCH01L23/473
Inventor 司新伟裴远涛庞成林
Owner XIAOMI INC
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